ZXMN3A02X8
ISSUE 1 - JANUARY 2002
2
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)
R
θJA
113 °C/W
Junction to Ambient (b)
R
θJA
70 °C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,
in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐10 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum
junction temperature.
THERMAL RESISTANCE
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage
V
DSS
30 V
Gate Source Voltage
V
GS
20 V
Continuous Drain Current V
GS
=10V; T
A
=25°C (b)
V
GS
=10V; T
A
=70°C (b)
V
GS
=10V; T
A
=25°C (a)
I
D
6.7
5.4
5.3
A
Pulsed Drain Current (c)
I
DM
24 A
Continuous Source Current (Body Diode) (b)
I
S
3.2 A
Pulsed Source Current (Body Diode) (c)
I
SM
24 A
Power Dissipation at T
A
=25°C (a)
Linear Derating Factor
P
D
1.1
8.8
W
mW/°C
Power Dissipation at T
A
=25°C (b)
Linear Derating Factor
P
D
1.8
14.4
W
mW/°C
Operating and Storage Temperature Range
T
j
:T
stg
-55 to +150 °C
ABSOLUTE MAXIMUM RATINGS.
