A3918SESTR-T

Low Voltage DC Motor Driver
A3918
7
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
PAD
A3918
C1
C2 C3
VBB
FL
GND
VCCIO
IN2
IN1
OUTA
OUTB
C4
R4
R6
C5 C6
R5
R2
CP4
CP1
CP3
VCP
IN2
GND
FL
GND
OUTA
SENSE
OUTB
CP2
GND
SLEEP
SLEEP
R1
R3
IN1
VBB
PCB
Thermal Vias
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
Thermal (2 oz.)
Solder
A3918
Layout The printed circuit board should use a heavy ground-
plane. For optimum electrical and thermal performance, the
A3918 must be soldered directly onto the board. On the under-
side of the A3918 package is an exposed pad, which provides a
path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias
are used to transfer heat to other layers of the PCB.
Grounding In order to minimize the effects of ground bounce
and offset issues, it is important to have a low impedance single-
point ground, known as a star ground, located very close to the
device. By making the connection between the exposed thermal
pad and the ground plane directly under the A3918, that area
becomes an ideal location for a star ground point. A low imped-
ance ground will prevent ground bounce during high current
operation and ensure that the supply voltage remains stable at
the input terminal. The recommended PCB layout shown in the
diagram below, illustrates how to create a star ground under the
device, to serve both as low impedance ground point and
thermal path.
The two input capacitors should be placed in parallel, and as
close to the device supply pin as possible. The ceramic capaci-
tor should be closer to the pin than the bulk capacitor. This is
necessary because the ceramic capacitor will be responsible for
delivering the high frequency current components.
Sense Pin The sense resistor, R
SENSE
, should have a very low
impedance path to ground, because it must carry a large current
while supporting very accurate voltage measurements by the cur-
rent sense comparator. Long ground traces will cause additional
voltage drops, adversely affecting the ability of the comparator to
accurately measure the current in the winding. As shown in the
layout below, the SENSE pin has very short traces to the R
SENSE
resistor and very thick, low impedance traces directly to the star
ground underneath the device. If possible, there should be no
other components on the sense circuit.
Note: When selecting a value for the sense resistor, be sure not to
exceed the maximum voltage on the SENSE pin of ±500 mV.
R3
R2
R1
R5
FL
IN2
VCCIO
IN1
C1 C2
C3
U1
GND
VBB
OUTB
OUTA
R4
R6
C4
C5
C6
SLEEP
Low Voltage DC Motor Driver
A3918
8
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
ES Package, 16-Contact QFN with Exposed Thermal Pad
Copyright ©2011-2013, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, LLC assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
C0.08
17X
A
Terminal #1 mark area
B
Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
For reference only, not for tooling use (reference JEDEC MO-220WEED)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
C
Reference land pattern layout (reference IPC7351
QFN50P300X300X80-17W4M);
All pads a minimum of 0.20 mm from all adjacent pads; adjust as
necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
exposed thermal pad land can improve thermal dissipation (reference
EIA/JEDEC Standard JESD51-5)
16
2
1
A
16
1
2
PCB Layout Reference View
B
1.70
1.70
1.70
1.70
0.30
1
16
0.50
0.90
3.10
3.10
C
C
SEATING
PLANE
0.25
+0.05
–0.07
0.40±0.10
0.50
0.75 ±0.05
3.00 ±0.15
3.00 ±0.15
D
D
Coplanarity includes exposed thermal pad and terminals

A3918SESTR-T

Mfr. #:
Manufacturer:
Description:
IC MOTOR DRIVER 2.5V-9V 16QFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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