NGTB50N60L2WG

© Semiconductor Components Industries, LLC, 2015
July, 2015 − Rev. 4
1 Publication Order Number:
NGTB50N60L2W/D
NGTB50N60L2WG
IGBT
This Insulated Gate Bipolar Transistor (IGBT) features a robust and
cost effective Field Stop (FS) Trench construction, and provides
superior performance in demanding switching applications, offering
both low on state voltage and minimal switching loss.
Features
Extremely Efficient Trench with Field Stop Technology
T
Jmax
= 175°C
Soft Fast Reverse Recovery Diode
Optimized for High Speed Switching
5 ms Short−Circuit Capability
These are Pb−Free Devices
Typical Applications
Motor Drive Inverters
Industrial Switching
Welding
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−emitter voltage V
CES
600 V
Collector current
@ T
C = 25°C
@ TC = 100°C
I
C
100
50
A
Diode Forward Current
@ T
C = 25°C
@ TC = 100°C
I
F
100
50
A
Diode Pulsed Current
T
PULSE
Limited by T
J
Max
I
FM
200 A
Pulsed collector current, T
pulse
limited by T
Jmax
I
CM
200 A
Short−circuit withstand time
V
GE
= 15 V, V
CE
= 400 V,
T
J
+150°C
t
SC
5
ms
Gate−emitter voltage
V
GE
$20
V
V
Transient gate−emitter voltage
(T
PULSE
= 5 ms, D < 0.10)
$30
Power Dissipation
@ T
C = 25°C
@ TC = 100°C
P
D
500
250
W
Operating junction temperature
range
T
J
−55 to +175 °C
Storage temperature range T
stg
−55 to +175 °C
Lead temperature for soldering, 1/8”
from case for 5 seconds
T
SLD
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
TO−247
CASE 340AL
C
G
50 A, 600 V
V
CEsat
= 1.50 V
E
OFF
= 0.6 mJ
E
Device Package Shipping
ORDERING INFORMATION
NGTB50N60L2WG TO−247
(Pb−Free)
30 Units / Rail
www.onsemi.com
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
MARKING DIAGRAM
50N60L2
AYWWG
G
E
C
NGTB50N60L2WG
www.onsemi.com
2
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal resistance junction−to−case, for IGBT
R
q
JC
0.28 °C/W
Thermal resistance junction−to−case, for Diode
R
q
JC
0.62 °C/W
Thermal resistance junction−to−ambient
R
q
JA
40 °C/W
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise specified)
Parameter Test Conditions Symbol Min Typ Max Unit
STATIC CHARACTERISTIC
Collector−emitter breakdown voltage,
gate−emitter short−circuited
V
GE
= 0 V, I
C
= 500 mA
V
(BR)CES
600 V
Collector−emitter saturation voltage V
GE
= 15 V, I
C
= 50 A
V
GE
= 15 V, I
C
= 50 A, T
J
= 175°C
V
CEsat
1.30
1.50
1.85
1.80
V
Gate−emitter threshold voltage
V
GE
= V
CE
, I
C
= 350 mA
V
GE(th)
4.5 5.5 6.5 V
Collector−emitter cut−off current, gate−
emitter short−circuited
V
GE
= 0 V, V
CE
= 600 V
V
GE
= 0 V, V
CE
= 600 V, T
J
=
175°C
I
CES
1.0
0.1
4.0
mA
Gate leakage current, collector−emitter
short−circuited
V
GE
= 20 V , V
CE
= 0 V I
GES
100 nA
DYNAMIC CHARACTERISTIC
Input capacitance
V
CE
= 20 V, V
GE
= 0 V, f = 1 MHz
C
ies
7500
pF
Output capacitance C
oes
300
Reverse transfer capacitance C
res
190
Gate charge total
V
CE
= 480 V, I
C
= 50 A, V
GE
= 15 V
Q
g
310
nC
Gate to emitter charge Q
ge
60
Gate to collector charge Q
gc
150
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD
Turn−on delay time
T
J
= 25°C
V
CC
= 400 V, I
C
= 50 A
R
g
= 10 W
V
GE
= 0 V/ 15 V
t
d(on)
110
ns
Rise time t
r
48
Turn−off delay time t
d(off)
270
Fall time t
f
70
Turn−on switching loss E
on
1.25
mJ
Turn−off switching loss E
off
0.6
Total switching loss E
ts
1.85
Turn−on delay time
T
J
= 150°C
V
CC
= 400 V, I
C
= 50 A
R
g
= 10 W
V
GE
= 0 V/ 15 V
t
d(on)
115
ns
Rise time t
r
50
Turn−off delay time t
d(off)
280
Fall time t
f
100
Turn−on switching loss E
on
1.6
mJ
Turn−off switching loss E
off
1.0
Total switching loss E
ts
2.6
DIODE CHARACTERISTIC
Forward voltage
V
GE
= 0 V, I
F
= 50 A
V
GE
= 0 V, I
F
= 50 A, T
J
= 175°C
V
F
1.40
1.70
2.40
2.50
V
Reverse recovery time
T
J
= 25°C
I
F
= 50 A, V
R
= 200 V
di
F
/dt = 200 A/ms
t
rr
67 ns
Reverse recovery charge Q
rr
0.30
mC
Reverse recovery current I
rrm
7.4 A
Reverse recovery time
T
J
= 175°C
I
F
= 50 A, V
R
= 400 V
di
F
/dt = 200 A/ms
t
rr
143 ns
Reverse recovery charge Q
rr
1.40
mC
Reverse recovery current I
rrm
15 A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
NGTB50N60L2WG
www.onsemi.com
3
TYPICAL CHARACTERISTICS
Figure 1. Output Characteristics Figure 2. Output Characteristics
V
CE
, COLLECTOR−EMITTER VOLTAGE (V) V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
86543210
Figure 3. Output Characteristics Figure 4. Typical Transfer Characteristics
V
CE
, COLLECTOR−EMITTER VOLTAGE (V) V
GE
, GATE−EMITTER VOLTAGE (V)
1050
Figure 5. V
CE(sat)
vs. T
J
T
J
, JUNCTION TEMPERATURE (°C)
1751501251007550250
I
C
, COLLECTOR CURRENT (A)
I
C
, COLLECTOR CURRENT (A)
V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
7
V
GE
= 20 V
to 13 V
T
J
= 25°C
9 V
8 V
7 V
8654321
I
C
, COLLECTOR CURRENT (A)
7
T
J
= 150°C
9 V
8 V
7 V
86543210
I
C
, COLLECTOR CURRENT (A)
7
T
J
= −55°C
9 V
8 V
T
J
= 25°C
T
J
= 150°C
200
V
GE
= 20 V
to 15 V
V
GE
= 20 V
to 13 V
1234 6789
−75 −50 −25
2.50
2.00
1.50
1.00
0.50
0
I
C
= 75 A
I
C
= 50 A
I
C
= 25 A
Figure 6. Typical Capacitance
V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
908050403020100
100,000
C, CAPACITANCE (pF)
100
C
ies
C
oes
C
res
7060
10 V
11 V
10 V
11 V
7 V
10 V
11 V
11 12 13
T
J
= 25°C
120
120
100
80
60
40
20
0
10,000
1000
100
10
1
100
80
60
40
20
0
0
200
180
160
140
120
100
80
60
40
20
0
200
180
160
140
120
100
80
60
40
20
0
200
180
160
140
140
160
13 V

NGTB50N60L2WG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IGBT Transistors 600V/50A LOW VCESAT FSII
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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