10
Precision Edge
®
SY89544U
Micrel, Inc.
M9999-082407
hbwhelp@micrel.com or (408) 955-1690
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
Disclaimer: This is only a recommendation based on information available to Micrel
from its suppliers. Actual land pattern may have to be significantly different due to
various materials and processes used in PCB assembly. Micrel makes no
representation or warranty of performance based on the recommended land pattern."
Gray shaded circles indicates Thermal Via. Size should be .300 mm in diameter and via hole pitch
is 1.0 mm and it should be connected to GND plane for maximum thermal characteristic.
PCB Thermal Consideration for 32-Pin MLF
®
Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
32 LEAD MicroLeadFrame
®
(MLF-32)
