MT18HTF12872FDY-667B5E3

Table 15: Serial Presence-Detect EEPROM AC Operating Conditions (Continued)
Parameter/Condition Symbol Min Max Units Notes
SDA and SCL rise time
t
R
0.3 µs 2
SCL clock frequency
f
SCL
400 kHz
Data-in setup time
t
SU:DAT 100
ns
Start condition setup time
t
SU:STA 0.6
µs 3
Stop condition setup time
t
SU:STO 0.6
µs
WRITE cycle time
t
WRC
10 ms 4
Notes:
1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1
and the falling or rising edge of SDA.
2. This parameter is sampled.
3. For a restart condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
t
WRC) is the time from a valid stop condition of a
write sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the
WRITE cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-
up resistance, and the EEPROM does not respond to its slave address.
Serial Presence-Detect Data
For the latest serial presence-detect data, refer to Micron's SPD page: www.micron.com/
SPD.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Serial Presence-Detect
PDF: 09005aef81a2f237
htf18c128_256x72fdy.pdf - Rev. D 12/09 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2005 Micron Technology, Inc. All rights reserved.
Module Dimensions
Figure 4: 240-Pin DDR2 FBDIMM
30.5 (1.201)
30.2 (1.189)
Pin 1
17.3 (0.681)
TYP
2.6 (0.102) D
(2X)
5.2 (0.205)
TYP
5.0 (0.197) TYP
123.0 (4.843)
TYP
1.0 (0.039)
TYP
0.8 (0.031)
TYP
1.5 (0.059) R
(4X)
0.75 (0.03) R
Pin 120
Front view
133.50 (5.256)
133.20 (5.244)
67.0 (2.638)
TYP
51.0 (2.01)
TYP
9.5 (0.374)
TYP
Back view
Pin 240
Pin 121
1.37 (0.054)
1.17 (0.046)
5.1 (0.201)
MAX
1.25 (0.0492)
TYP
66.68 (2.63) TYP
0.595 (0.0234) R
2.0 (0.079)
TYP
3.9 (0.153)
TYP
(x2)
120° (2X)
2.18 (0.086) TYP
74.68 (2.94)
TYP
3.05 (0.12) TYP
66.68 (2.63)
TYP
24.95 (0.982)
TYP
Detail A
Detail A
1.19 (0.047)
1.06 (0.042)
1.06 (0.042)
45° x 0.18 (0.0071)
0.5 (0.02) R
(4X)
0.75 (0.03) R 8X
9.9 (0.39)
TYP
(x4)
Front view with heat spreader
Back view with heat spreader
7.68 (0.302)
MAX*
3.1 (0.122) TYP
5.48 (0.216)
TYP
U1 U2
U3
U4 U5
U6 U7 U8 U10 U11
U9
U9
U1 U2
U3
U4 U5
U6 U7 U8 U10 U11
1.37 (0.054)
1.17 (0.046)
*Including clip radius
7.92 (0.312)
Notes:
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for
additional design dimensions.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Module Dimensions
PDF: 09005aef81a2f237
htf18c128_256x72fdy.pdf - Rev. D 12/09 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2005 Micron Technology, Inc. All rights reserved.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Module Dimensions
PDF: 09005aef81a2f237
htf18c128_256x72fdy.pdf - Rev. D 12/09 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2005 Micron Technology, Inc. All rights reserved.

MT18HTF12872FDY-667B5E3

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR2 SDRAM 1GB 240FBDIMM
Lifecycle:
New from this manufacturer.
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