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VNQ810PEP-E

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
VNQ810PEP-E Application information
Doc ID 10872 Rev 8 19/28
3.4 Open load detection in off-state
Off-state open load detection requires an external pull-up resistor (R
PU
) connected between
OUTPUT pin and a positive supply voltage (V
PU
) like the +5V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1) no false open load indication when load is connected: in this case we have to avoid V
OUT
to be higher than V
Olmin
; this results in the following condition
V
OUT
= (V
PU
/ (R
L
+ R
PU
))R
L
< V
Olmin.
2) no misdetection when load is disconnected: in this case the V
OUT
has to be higher than
V
OLmax
; this results in the following condition R
PU
< (V
PU
- V
OLmax
) / I
L(off2)
.
Because I
s(OFF)
may significantly increase if V
out
is pulled high (up to several mA), the pull-
up resistor R
PU
should be connected to a supply that is switched OFF when the module is in
standby.
Figure 25. Openload detection in Off-state
Obsolete Product(s) - Obsolete Product(s)
Application information VNQ810PEP-E
20/28 Doc ID 10872 Rev 8
3.5 Maximum demagnetization energy (V
CC
= 13.5V)
Figure 26. Maximum turn-off current versus load inductance
Note: Values are generated with R
L
= 0
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization
Demagnetization
Demagnetization
A = single pulse at T
Jstart
= 150ºC
B= repetitive pulse at T
Jstart
= 100ºC
C= repetitive pulse at T
Jstart
= 125ºC
1
10
100
0.01 0.1 1 10 100
L(mH)
I
LMAX (A)
A
B
C
Obsolete Product(s) - Obsolete Product(s)
VNQ810PEP-E Package and PC board thermal data
Doc ID 10872 Rev 8 21/28
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 27. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area= 78 mm x 78 mm, PCB
thickness=2 mm, Cu thickness=70 mm (front and back side), Copper areas: from minimum
pad lay-out to 8 cm
2
).
Figure 28.
R
thj-amb
vs. PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
60
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

VNQ810PEP-E

Mfr. #:
Buy VNQ810PEP-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
Delivery:
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