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VNQ810PEP-E
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P28
Package and PC board thermal data
VNQ810PEP-E
22/28
Doc ID 10872 Rev 8
Figure 29.
PowerSSO-24 thermal impedan
ce junction ambien
t
single pulse (one
channel ON)
Figure 30.
Thermal fitting model of a doub
le channel HSD in PowerSSO-24
(b)
b.
The fitting model is a semplified thermal tool and is
valid for transient evolut
ions where the embedded
protections (power limitation or thermal cycling during
ther
mal shutdown) are not triggered.
0.
1
1
10
100
0.
0001
0.
001
0.
01
0.
1
1
10
100
1000
Ti
me
(s
)
ZTH (
°
C/
W
)
Footprint
8 cm
2
Obsolete Product(s) - Obsolete Product(s)
VNQ810PEP-E
Package and PC
board thermal data
Doc ID 10872 Rev 8
23/28
Equation 1
: pulse calculatio
n formula
where
= t
P
/T
T
able 16.
Thermal parameters
Area/island (cm
2
)F
o
o
t
p
r
i
n
t
8
R1 = R7 = R9 = R1
1 (°C/W)
0.1
R2 = R8 = R10 =
R12 (°C/W)
0.9
R3 (°C/W)
1
R4 (°C/W)
4
R5 (°C/W)
13.5
R6 (°C/W)
37
22
C1 = C7 = C9 = C1
1 (W
.s/°C)
0.0006
C2 = C8 = C
10 = C12 (W
.s/°C)
0
.0025
C3 (W
.s/°C)
0.025
C4 (W
.s/°C)
0.08
C5 (W
.s/°C)
0.7
C6 (W
.s/°C)
3
5
Z
TH
R
TH
Z
THtp
1
–
+
=
Obsolete Product(s) - Obsolete Product(s)
Package and packin
g information
VNQ810PEP-E
24/28
Doc ID 10872 Rev 8
5
Package and p
acking information
5.1 ECOP
ACK
®
p
ackages
In order to meet environ
mental requ
irements, ST of
fers these devices in dif
ferent grades of
ECOP
ACK
®
packages, dependin
g on their level of environment
al compliance. ECOP
ACK
®
specifications, grade definitions a
nd product status are available at:
www
.st.com
.
ECOP
ACK
®
is an ST tradem
ark.
5.2 PowerSSO-24
mechanical
dat
a
Figure 31.
PowerSSO-24 p
ackage dimensions
Obsolete Product(s) - Obsolete Product(s)
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P18
P19-P21
P22-P24
P25-P27
P28-P28
VNQ810PEP-E
Mfr. #:
Buy VNQ810PEP-E
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
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VNQ810PEP-E
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