Package and PC board thermal data VNQ810PEP-E
22/28 Doc ID 10872 Rev 8
Figure 29. PowerSSO-24 thermal impedance junction ambient single pulse (one
channel ON)
Figure 30. Thermal fitting model of a double channel HSD in PowerSSO-24
(b)
b. The fitting model is a semplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
0.1
1
10
100
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
Footprint
8 cm
2
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VNQ810PEP-E Package and PC board thermal data
Doc ID 10872 Rev 8 23/28
Equation 1: pulse calculation formula
where = t
P
/T
Table 16. Thermal parameters
Area/island (cm
2
)Footprint8
R1 = R7 = R9 = R11 (°C/W) 0.1
R2 = R8 = R10 = R12 (°C/W) 0.9
R3 (°C/W) 1
R4 (°C/W) 4
R5 (°C/W) 13.5
R6 (°C/W) 37 22
C1 = C7 = C9 = C11 (W.s/°C) 0.0006
C2 = C8 = C10 = C12 (W.s/°C) 0.0025
C3 (W.s/°C) 0.025
C4 (W.s/°C) 0.08
C5 (W.s/°C) 0.7
C6 (W.s/°C) 3 5
Z
TH
R
TH
Z
THtp
1 +=
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Package and packing information VNQ810PEP-E
24/28 Doc ID 10872 Rev 8
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
5.2 PowerSSO-24 mechanical data
Figure 31. PowerSSO-24 package dimensions
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VNQ810PEP-E

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Quad Ch HiSide Drivr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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