ESDM1131
www.onsemi.com
6
PACKAGE DIMENSIONS
X4DFN2, 0.445x0.24, 0.27P
CASE 718AA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. EXPOSED COPPER ALLOWED AS SHOWN.
A
B
E
D
BOTTOM VIEW
b
e
2X
L2X
TOP VIEW
A
A1
0.03 C
0.03 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN NOM
MILLIMETERS
A 0.15 0.18
A1 −−− −−−
b 0.170 0.185
e 0.270 BSC
L 0.105 0.120
MOUNTING FOOTPRINT*
DIMENSIONS: MILLIMETERS
0.27
1
0.21
0.13
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
2
PIN 1
See Application Note AND8398/D for more mounting details
2X
2X
RECOMMENDED
PIN 1
REFERENCE
D 0.415 0.445
E 0.210 0.240
A0.10 BC
0.05
C
e/2
NOTE 3
MAX
0.21
0.03
0.200
0.135
0.475
0.270
PITCH
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