IRFR9214, IRFU9214, SiHFR9214, SiHFU9214
www.vishay.com
Vishay Siliconix
S13-0166-Rev. D, 04-Feb-13
1
Document Number: 91282
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Power MOSFET
FEATURES
•P-Channel
• Surface Mount (IRFR9214, SiHFR9214)
• Straight Lead (IRFU9214, SiHFU9214)
• Advanced Process Technology
• Fast Switching
• Fully Avalanche Rated
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
Third generation power MOSFETs from Vishay utilize
advanced processing techniques to achieve low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting T
J
= 25 °C, L = 27 mH, R
g
= 25 , I
AS
= - 2.7 A (see fig. 12).
c. I
SD
- 2.7 A, dI/dt 600 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) - 250
R
DS(on)
()V
GS
= - 10 V 3.0
Q
g
(Max.) (nC) 14
Q
gs
(nC) 3.1
Q
gd
(nC) 6.8
Configuration Single
DPAK
(TO-252)
IPAK
(TO-251)
G
D
S
S
D
G
D
ORDERING INFORMATION
Package DPAK (TO-252) DPAK (TO-252) DPAK (TO-252) IPAK (TO-251)
Lead (Pb)-free and Halogen-free SiHFR9214-GE3 SiHFR9214TRL-GE3 SiHFR9214TR-GE3 SiHFU9214-GE3
Lead (Pb)-free
IRFR9214PbF IRFR9214TRLPbF
a
IRFR9214TRPbF
a
IRFU9214PbF
SiHFR9214-E3 SiHFR9214TL-E3
a
SiHFR9214T-E3
a
SiHFU9214-E3
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
- 250
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current V
GS
at - 10 V
T
C
= 25 °C
I
D
- 2.7
AT
C
= 100 °C - 1.7
Pulsed Drain Current
a
I
DM
- 11
Linear Derating Factor 0.40 W/°C
Single Pulse Avalanche Energy
b
E
AS
100 mJ
Repetitive Avalanche Current
a
I
AR
- 2.7 A
Repetitive Avalanche Energy
a
E
AR
5.0 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
50 W
Peak Diode Recovery dV/dt
c
dV/dt - 5.0 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature)
d
for 10 s 260