MT4VDDT1664HY-335F3

PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
10 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Idd Specifications
Table 10: Idd Specifications and Conditions – 128MB (All Other Die Revisions)
Values are for the MT46V16M16 DDR SDRAM only and are computed from values specified in the
256Mb (16 Meg x 16) component data sheet
Parameter/Condition Symbol -40B -335
-26A/
-265
Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing
once per clock cycle; Address and control inputs changing once
every two clock cycles
Idd0 540 500 480 mA
Operating one bank active-read-precharge current:
BL = 4;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Iout= 0mA; Address and
control inputs changing once per clock cycle
Idd1 740 720 620 mA
Precharge power-down standby current: All device banks idle;
Power-down mode;
t
CK =
t
CK (MIN); CKE = (LOW)
Idd2P 16 16 16 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK=
t
CK(MIN); C KE = HIGH; Address and other control inputs
changing once per clock cycle; Vin = Vref for
DQ, DM, and DQS
Idd2F 240 200 180 mA
Active power-down standby current: One device bank active;
Power-down mode;
t
CK =
t
CK (MIN); CKE = LOW
Idd3P 160 120 100/
120
mA
Active standby current: CS# = HIGH; CKE = HIGH; One device
bank;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs
changing twice per clock cycle; Address and other control inputs
changing once per clock cycle
Idd3N 280 240 200 mA
Operating burst read current: BL = 2; Continuous burst reads;
One device bank active; Address and control inputs changing once
per clock cycle;
t
CK =
t
CK (MIN); Iout = 0mA
Idd4R 1040 880 740 mA
Operating burst write current: BL = 2; Continuous burst writes;
One device bank active; Address and control inputs changing once
per clock cycle;
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing
twice per clock cycle
Idd4W 860 780 640 mA
Auto refresh current
t
RFC =
t
RFC (MIN)
Idd5 1040 1020 940/
980
mA
t
RFC = 7.8125µs
Idd5A 24 24 24 mA
Self refresh current: CKE 0.2V
Idd6 16 16 16 mA
Operating bank interleave read current: Four device bank
interleaving (BL = 4) with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK
(MIN); Address and control inputs change only during active READ
or WRITE commands
Idd7 2046 1760 1520/
1600
mA
PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
11 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Idd Specifications
Table 11: Idd Specifications and Conditions – 256MB
Values are for the MT46V32M16 DDR SDRAM only and are computed from values specified in the
512Mb (32 Meg x 16) component data sheet
Parameter/Condition Symbol -40B -335 -265 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing
once per clock cycle; Address and control inputs changing once
every two clock cycles
Idd0 620 520 460 mA
Operating one bank active-read-precharge current:
BL = 4;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Iout= 0mA; Address and
control inputs changing once per clock cycle
Idd1 780 640 580 mA
Precharge power-down standby current: All device banks idle;
Power-down mode;
t
CK =
t
CK (MIN); CKE = (LOW)
Idd2P 20 20 20 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK=
t
CK(MIN); C KE = HIGH; Address and other control inputs
changing once per clock cycle; Vin = Vref for
DQ, DM, and DQS
Idd2F 220 180 160 mA
Active power-down standby current: One device bank active;
Power-down mode;
t
CK =
t
CK (MIN); CKE = LOW
Idd3P 180 140 120 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device
bank;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs
changing twice per clock cycle; Address and other control inputs
changing once per clock cycle
Idd3N 240 200 180 mA
Operating burst read current: BL = 2; Continuous burst reads;
One device bank active; Address and control inputs changing once
per clock cycle;
t
CK =
t
CK (MIN); Iout = 0mA
Idd4R 840 660 580 mA
Operating burst write current: BL = 2; Continuous burst writes;
One device bank active; Address and control inputs changing once
per clock cycle;
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing
twice per clock cycle
Idd4W 860 780 540 mA
Auto refresh current
t
RFC =
t
RFC (MIN)
Idd5 1380 1160 1120 mA
t
RFC = 7.8125µs
Idd5A 44 40 40 mA
Self refresh current: CKE 0.2V
Idd6 24 20 20 mA
Operating bank interleave read current: Four device bank
interleaving (BL = 4) with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK
(MIN); Address and control inputs change only during active READ
or WRITE commands
Idd7 1920 1620 1400 mA
PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
12 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Serial Presence-Detect
Serial Presence-Detect
Notes: 1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1 and
the falling or rising edge of SDA.
2. This parameter is sampled.
3. For a restart condition or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
t
WRC) is the time from a valid stop condition of a write
sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the WRITE
cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-up resis-
tance, and the EEPROM does not respond to its slave address.
Serial Presence-Detect Data
For the latest serial presence-detect data, refer to Microns SPD page:
www.micron.com/SPD.
Table 12: Serial Presence-Detect EEPROM DC Operating Conditions
Parameter/Condition Symbol Min Max Units
Supply voltage Vddspd 2.3 3.6 V
Input high voltage: Logic 1; All inputs Vih Vddspd × 0.7 Vddspd + 0.5 V
Input low voltage: Logic 0; All inputs Vil –1.0 Vddspd × 0.3 V
Output low voltage: Iout = 3mA Vol 0.4 V
Input leakage current: Vin = GND to Vdd Ili 10 µA
Output leakage current: Vout = GND to Vdd Ilo 10 µA
Standby current: SCL = SDA = Vdd - 0.3V; All other inputs = Vss or Vdd Isb 30 µA
Power supply current: SCL clock frequency = 100 kHz Icc 2.0 mA
Table 13: Serial Presence-Detect EEPROM AC Operating Conditions
Parameter/Condition Symbol Min Max Units Notes
SCL LOW to SDA data-out valid
t
AA 0.2 0.9 µs 1
Time the bus must be free before a new transition can start
t
BUF 1.3 µs
Data-out hold time
t
HD:DAT 200 ns
SDA fall time
t
F 300 ns 2
SDA rise time
t
R 300 ns 2
Data-in hold time
t
HD:DI 0 µs
Start condition hold time
t
HD:STA 0.6 µs
Clock HIGH period
t
HIGH 0.6 µs
Clock LOW period
t
LOW 1.3 µs
SCL clock frequency
f
SCL 400 kHz
Data-in setup time
t
SU:DAT 100 ns
Start condition setup time
t
SU:STA 0.6 µs 3
Stop condition setup time
t
SU:STO 0.6 µs
WRITE cycle time
t
WRC –5ms4

MT4VDDT1664HY-335F3

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 128MB 200SODIMM
Lifecycle:
New from this manufacturer.
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