MT4VDDT1664HY-335F3

PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
7 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed in Table 7 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in each devices data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
Notes: 1. For further information, refer to technical note TN-00-08: “Thermal Applications,” available
on Micron’s Web site.
Table 7: Absolute Maximum DC Ratings
Symbol Parameter Min Max Units
Vdd
Vdd supply voltage relative to Vss
–1 +3.6 V
Vin, Vout
Voltage on any pin relative to Vss
–0.5 +3.2 V
Ii
Input leakage current; Any input 0V Vin Vdd;
Vref input 0V Vin 1.35V (All other pins not under
test = 0V)
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
–8 +8 µA
CK, CK#
–4 +4
DM
–2 +2
Ioz
Output leakage current; 0V Vout Vddq; DQ and
ODT are disabled
DQ, DQS
–5 +5 µA
T
A
DRAM ambient operating temperature
1
Commercial
0+70°C
Industrial
–40 +85 °C
PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
8 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Electrical Specifications
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR component data sheets.
Component specifications are available on Microns Web site. Module speed grades
correlate with component speed grades, as shown in Table 8.
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully
designed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the systems
memory bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to
ensure the required supply voltage is maintained.
Table 8: Module and Component Speed Grades
DDR components may exceed the listed module speed grades
Module Speed Grade Component Speed Grade
-40B -5B
-335 -6
-26A -75Z
-265 -75
PDF: 09005aef837131bb/Source: 09005aef8086ea0b Micron Technology, Inc., reserves the right to change products or specifications without notice.
dd4c16_32x64h.fm - Rev. E 10/08 EN
9 ©2003 Micron Technology, Inc. All rights reserved.
128MB, 256MB (x64, SR) 200-Pin DDR SDRAM SODIMM
Idd Specifications
Idd Specifications
Table 9: Idd Specifications and Conditions – 128MB (Die Revision K)
Values are for the MT46V16M16 DDR SDRAM only and are computed from values specified in the
256Mb (16 Meg x 16) component data sheet
Parameter/Condition Symbol -40B -335 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing once per clock
cycle; Address and control inputs changing once every two clock cycles
Idd0 400 360 mA
Operating one bank active-read-precharge current:
BL = 4;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Iout= 0mA; Address and control inputs
changing once per clock cycle
Idd1 480 460 mA
Precharge power-down standby current: All device banks idle; Power-down
mode;
t
CK =
t
CK (MIN); CKE = (LOW)
Idd2P 16 16 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK=
t
CK(MIN);
CKE = HIGH; Address and other control inputs
changing once per clock cycle;
Vin = Vref for
DQ, DM, and DQS
Idd2F 200 200 mA
Active power-down standby current: One device bank active; Power-down
mode;
t
CK =
t
CK (MIN); CKE = LOW
Idd3P 140 120 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device bank;
t
RC =
t
RAS
(MAX);
t
CK =
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once per clock cycle
Idd3N 240 220 mA
Operating burst read current: BL = 2; Continuous burst reads; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN);
Iout = 0mA
Idd4R 720 640 mA
Operating burst write current: BL = 2; Continuous burst writes; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN);
DQ, DM, and DQS inputs changing twice per clock cycle
Idd4W 720 640 mA
Auto refresh current
t
RFC =
t
RFC (MIN)
Idd5 640 640 mA
t
RFC = 7.8125µs
Idd5A 24 24 mA
Self refresh current: CKE 0.2V
Idd6 16 16 mA
Operating bank interleave read current: Four device bank interleaving (BL = 4)
with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Address and control inputs
change only during active READ or WRITE commands
Idd7 1160 1080 mA

MT4VDDT1664HY-335F3

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 128MB 200SODIMM
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