CAUTION
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN PACKAGES OR HANDLE
EXCEPT AT A STATIC-FREE WORKSTATION
GENNUM CORPORATION
Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3
Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5
Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946
GENNUM JAPAN CORPORATION
Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan
Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505
GENNUM UK LIMITED
25 Long Garden Walk, Farnham, Surrey, England GU9 7HX
Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523
Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the
circuits or devices described herein. The sale of the circuit or device described herein does not imply any
patent license, and Gennum makes no representation that the circuit or device is free from patent infringement.
GENNUM and the G logo are registered trademarks of Gennum Corporation.
© Copyright 2005 Gennum Corporation. All rights reserved. Printed in Canada.
www.gennum.com
GS9078A Data Sheet
34165 - 4 March 2006
14
14 of 14
DOCUMENT IDENTIFICATION
DATA SHEET
The product is in production. Gennum reserves the right to make
changes to the product at any time without notice to improve reliability,
function or design, in order to provide the best product possible.
7. Revision History
Version ECR PCN Date Changes and/or Modifications
A 135926 – February 2005 New document.
0 136048 – February 2005 Converting to Preliminary Data Sheet.
Added PCB Layout section. Updated
Typical Application Circuit.
1 136655 – June 2005 Converted to Data Sheet. Changed title
of Figure 2-2 to clarify that this is the Pb
reflow profile. Updated Additive Jitter
number in AC Electrical Characteristics
table to be typically 20ps
p-p
. Updated
dimensions of the center pad of the PCB
footprint in Section 6.2 to match the
dimensions of the center pad of the
device. Corrected part number in
ordering information. Rephrased the
RoHS Compliant statement.
2 137887 – September 2005 Corrected process to BiCMOS.
3 139115 38124 January 2006 Corrected Input Differential Swing to
2200mV.
4 139636 38695 March 2006 Corrected pad standoff height and
tolerances for pad width & package
dimension. Corrected pad shape.
