Semiconductor Components Industries, LLC, 2004
August, 2004 − Rev. 3
1 Publication Order Number:
NTD32N06/D
NTD32N06
Power MOSFET
32 Amps, 60 Volts, N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
• Smaller Package than MTB36N06V
• Lower R
DS(on)
• Lower V
DS(on)
• Lower Total Gate Charge
• Lower and Tighter V
SD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 Vdc
Drain−to−Gate Voltage (R
GS
= 10 M) V
DGR
60 Vdc
Gate−to−Source Voltage, Continuous
− Non−Repetitive (t
p
10 ms)
V
GS
V
GS
20
30
Vdc
Drain Current
− Continuous @ T
A
= 25°C
− Continuous @ T
A
= 100°C
− Single Pulse (t
p
10 s)
I
D
I
D
I
DM
32
22
90
Adc
Apk
Total Power Dissipation @ T
A
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C (Note 1)
Total Power Dissipation @ T
A
= 25°C (Note 2)
P
D
93.75
0.625
2.88
1.5
W
W/°C
W
W
Operating and Storage Temperature Range T
J
, T
stg
−55 to
+175
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
J
= 25°C (Note 3)
(V
DD
= 50 Vdc, V
GS
= 10 Vdc, L = 1.0 mH,
I
L(pk)
= 25 A, V
DS
= 60 Vdc, R
G
= 25 )
E
AS
313 mJ
Thermal Resistance − Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
JC
R
JA
R
JA
1.6
52
100
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T
L
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size,
(Cu Area 1.127 in
2
).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in
2
).
3. Repetitive rating; pulse width limited by maximum junction temperature.
N−Channel
D
S
G
60 V 26 m
R
DS(on)
TYP
32 A
I
D
MAXV
(BR)DSS
1
Gate
3
Source
2
Drain
4
Drain
DPAK
CASE 369C
STYLE 2
32N06 = Device Code
A = Assembly Location
Y = Year
WW = Work Week
1
2
3
4
DPAK−3
CASE 369D
STYLE 2
1
2
3
4
MARKING
DIAGRAMS
AYWW
32N06
1
Gate
3
Source
2
Drain
4
Drain
AYWW
32N06
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
