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2 - 6
20110118b
MIXA40W1200TML
IXYS reserves the right to change limits, test conditions and dimensions.
IGBT T1 - T6
Ratings
Symbol Definitions Conditions min. typ. max. Unit
V
CES
collector emitter voltage
T
VJ
= 25°C 1200 V
V
GES
V
GEM
max. DC gate voltage
max. transient collector gate voltage
continuous
transient
±20
±30
V
V
I
C25
I
C80
collector current
T
C
= 25°C
T
C
= 80°C
60
40
A
A
P
tot
total power dissipation
T
C
= 25°C 195 W
V
CE(sat)
collector emitter saturation voltage
I
C
= 35 A; V
GE
= 15 V T
VJ
= 25°C
T
VJ
= 125°C
1.8
2.1
2.1 V
V
V
GE(th)
gate emitter threshold voltage
I
C
= 1.5 mA; V
GE
= V
CE
T
VJ
= 25°C 5.4 5.9 6.5 V
I
CES
collector emitter leakage current
V
CE
= V
CES
; V
GE
= 0 V T
VJ
= 25°C
T
VJ
= 125°C
0.02
0.3
0.15 mA
mA
I
GES
gate emitter leakage current
V
GE
= ±20 V 500 nA
Q
G(on)
total gate charge
V
CE
= 600 V; V
GE
= 15 V; I
C
= 35 A 106 nC
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load T
VJ
= 125°C
V
CE
= 600 V; I
C
= 35 A
V
GE
= ±15 V; R
G
= 27 W
70
40
250
100
3.8
4.1
ns
ns
ns
ns
mJ
mJ
RBSOA
reverse bias safe operating area
V
GE
= ±15 V; R
G
= 27 W; V
CEK
= 1200 V
T
VJ
= 125°C
105 A
I
SC
(SCSOA)
short circuit safe operating area
V
CE
= 900 V; V
GE
= ±15 V; T
VJ
= 125°C
R
G
= 27 W; t
p
= 10 µs; non-repetitive
140 A
R
thJC
R
thCH
thermal resistance junction to case
thermal resistance case to heatsink
(per IGBT)
0.21
0.64 K/W
K/W
Diode D1 - D6
Ratings
Symbol Definitions Conditions min. typ. max. Unit
V
RRM
max. repetitve reverse voltage
T
VJ
= 25°C 1200 V
I
F25
I
F80
forward current
T
C
= 25°C
T
C
= 80°C
44
29
A
A
V
F
forward voltage
I
F
= 30 A; V
GE
= 0 V T
VJ
= 25°C
T
VJ
= 125°C
1.95
1.95
2.2 V
V
Q
rr
I
RM
t
rr
E
rec
reverse recovery charge
max. reverse recovery current
reverse recovery time
reverse recovery energy
V
R
= 600 V
di
F
/dt = -600 A/µs T
VJ
= 125°C
I
F
= 30 A; V
GE
= 0 V
3.5
30
350
0.9
µC
A
ns
mJ
R
thJC
R
thCH
thermal resistance junction to case
thermal resistance case to heatsink
(per diode)
0.4
1.2 K/W
K/W
