NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 31 / 37
16 Bare die outline
For more details on the wafer delivery forms, see Ref. 9.
L
A
LB
V
S
S
4
3
4
3
238
x
y
TESTIO
x [µm] y [µm]
658
(1)
60
713
(1)
60
Chip Step (8 inches)
Bump size
LA, LB, VSS, TEST
typ. 713
(1)
typ. 1
9
(1)
min. 5
typ. 19
(1)
min. 5
6
3
3
aaa-012193
typ. 658
(1)
578
Chip Step (12 inches)
660 715
1. Laser dicing: The air gap and thus the step size may vary due to varying foil expansion
2. All dimensions in μm, pad locations measured from metal ring edge (see detail)
Figure 25. Bare die outline MF1S70yyXDUz/V1
17 Abbreviations
Table 33. Abbreviations and symbols
Acronym Description
ACK ACKnowledge
ATQA Answer To reQuest, Type A
CRC Cyclic Redundancy Check
CT Cascade Tag (value 88h) as defined in ISO/IEC 14443-3 Type A
EEPROM Electrically Erasable Programmable Read-Only Memory
FDT Frame Delay Time
FFC Film Frame Carrier
IC Integrated Circuit
LCR L = inductance, Capacitance, Resistance (LCR meter)
LSB Least Significant Bit
NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 32 / 37
Acronym Description
NAK Not AcKnowledge
NUID Non-Unique IDentifier
NV Non-Volatile memory
PCD Proximity Coupling Device (Contactless Reader)
PICC Proximity Integrated Circuit Card (Contactless Card)
REQA REQuest command, Type A
RID Random ID
RF Radio Frequency
RMS Root Mean Square
RNG Random Number Generator
SAK Select AcKnowledge, type A
SECS-II SEMI Equipment Communications Standard part 2
TiW Titanium Tungsten
UID Unique IDentifier
WUPA Wake-Up Protocol type A
18 References
[1]
MIFARE (Card) Coil Design Guide
Application note, BU-ID Document number 0117**
1
[2]
MIFARE Type Identification Procedure
Application note, BU-ID Document number 0184**
1
[3]
ISO/IEC 14443-2
2001
[4]
ISO/IEC 14443-3
2001
[5]
MIFARE & I-CODE CLRC632 Multiple protocol contactless reader IC
Product data sheet
[6]
MIFARE and handling of UIDs
1 ** ... document version number
NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 33 / 37
Application note, BU-ID Document number 1907**
1
[7]
Contactless smart card module specification MOA4
Delivery Type Description, BU-ID Document number 0823**
1
[8]
Contactless smart card module specification MOA8
Delivery Type Description, BU-ID Document number 1636**
1
[9]
General specification for 8" wafer on UV-tape with electronic fail die marking;
delivery types
Delivery Type Description, BU-ID Document number 1093**
1
19 Revision history
Table 34. Revision history
Document ID Release date Data sheet status Change notice Supersedes
MF1S70yyX_V1 v.3.2 20171127 Product data sheet - MF1S70yyX_V1 v.3.1
Modifications: 12 inch FFC delivery forms added
Format udpated
MF1S70yyX_V1 v.3.1 20140908 Product data sheet - MF1S70yyX_V1 v.3.0
Modifications: NXP originality check support only for 1 kB memory version
Wafer delivery specification reference corrected
MF1S70yyX_V1 v.3.0 20140303 Product data sheet - -

MF1S7031XDUF/V1V

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
Lifecycle:
New from this manufacturer.
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