NXP Semiconductors
MF1S70YYX_V1
MIFARE Classic EV1 4K - Mainstream contactless smart card IC for fast and easy solution development
MF1S70yyX_V1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product data sheet Rev. 3.2 — 23 November 2017
COMPANY PUBLIC 279332 33 / 37
Application note, BU-ID Document number 1907**
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[7]
Contactless smart card module specification MOA4
Delivery Type Description, BU-ID Document number 0823**
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[8]
Contactless smart card module specification MOA8
Delivery Type Description, BU-ID Document number 1636**
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[9]
General specification for 8" wafer on UV-tape with electronic fail die marking;
delivery types
Delivery Type Description, BU-ID Document number 1093**
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19 Revision history
Table 34. Revision history
Document ID Release date Data sheet status Change notice Supersedes
MF1S70yyX_V1 v.3.2 20171127 Product data sheet - MF1S70yyX_V1 v.3.1
Modifications: • 12 inch FFC delivery forms added
• Format udpated
MF1S70yyX_V1 v.3.1 20140908 Product data sheet - MF1S70yyX_V1 v.3.0
Modifications: • NXP originality check support only for 1 kB memory version
• Wafer delivery specification reference corrected
MF1S70yyX_V1 v.3.0 20140303 Product data sheet - -