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VND810SP13TR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27
VND810SP Application information
Doc ID 7377 Rev 5 19/27
3.5 Maximum demagnetization energy (V
CC
= 13.5 V)
Figure 26. Maximum turn-off current versus load inductance
(1)
1. Values are generated with R
L
= 0Ω.
In case of repetitive pulses, T
jstart
(at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves B and C.
V
IN
, I
L
t
Demagnetization
Demagnetization
Demagnetization
A = single pulse at T
Jstart
= 150 °C
B= repetitive pulse at T
Jstart
= 100 °C
C= repetitive pulse at T
Jstart
= 125 °C
1
10
0,01 0,1 1 10 100
L(mH)
I
LM AX (A)
A
B
C
Obsolete Product(s) - Obsolete Product(s)
Package and PCB thermal data VND810SP
20/27 Doc ID 7377 Rev 5
4 Package and PCB thermal data
4.1 PowerSO-10 thermal data
Figure 27. PowerSO-10 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,
Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 28. R
thj-amb
vs PCB copper area in open box free air condition
30
35
40
45
50
55
0246810
PCB Cu heatsink area (cm^2)
RTHj_amb (°C/W)
Tj-Tamb=50°C
Obsolete Product(s) - Obsolete Product(s)
VND810SP Package and PCB thermal data
Doc ID 7377 Rev 5 21/27
Figure 29. Thermal impedance junction ambient single pulse
Equation 1
:
pulse calculation formula
Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10
0.1
1
10
100
1000
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
ZTH (°C/W)
0.5 cm
2
6 cm
2
Z
THδ
R
TH
δ Z
THtp
1 δ–()+⋅=
where
δ t
p
T⁄=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
Obsolete Product(s) - Obsolete Product(s)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27

VND810SP13TR

Mfr. #:
Buy VND810SP13TR
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Double Ch High Side
Lifecycle:
New from this manufacturer.
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