Package and PCB thermal data VND810SP
22/27 Doc ID 7377 Rev 5
Table 14. Thermal parameters
Area / island (cm
2
)Footprint6
R1 (°C/W) 0.35
R2 (°C/W) 1.8
R3 (°C/W) 1.1
R4 (°C/W) 0.8
R5 (°C/W) 12
R6 (°C/W) 37 22
C1 (W.s/°C) 0.0001
C2 (W.s/°C) 7E-04
C3 (W.s/°C) 0.008
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.75
C6 (W.s/°C) 3 5
Obsolete Product(s) - Obsolete Product(s)
VND810SP Package and packing information
Doc ID 7377 Rev 5 23/27
5 Package and packing information
5.1 ECOPACK
®
packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
5.2 PowerSO-10 mechanical data
Figure 31. PowerSO-10 package dimensions
DETAIL "A"
PLANE
SEATING
α
L
A1
F
A1
h
A
D
D1
= =
= =
E4
0.10 A
E
C
A
B
B
DETAIL "A"
SEATING
PLANE
E2
10
1
eB
HE
0.25
Obsolete Product(s) - Obsolete Product(s)
Package and packing information VND810SP
24/27 Doc ID 7377 Rev 5
Table 15. PowerSO-10 mechanical data
Dim.
mm
Min. Typ. Max.
A3.35 3.65
A
(1)
1. Muar only POA P013P.
3.4 3.6
A1 0 0.10
B0.40 0.60
B
(1)
0.37 0.53
C0.35 0.55
C
(1)
0.23 0.32
D9.40 9.60
D1 7.40 7.60
E9.30 9.50
E2 7.20 7.60
E2
(1)
7.30 7.50
E4 5.90 6.10
E4
(1)
5.90 6.30
e1.27
F1.25 1.35
F
(1)
1.20 1.40
H 13.80 14.40
H
(1)
13.85 14.35
h0.50
L1.20 1.80
L
(1)
0.80 1.10
α
α
(1)
Obsolete Product(s) - Obsolete Product(s)

VND810SP13TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers Double Ch High Side
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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