Figure 6: 78-Ball FBGA (package code THV)
Ball A1 ID
1.2 MAX0.8 TYP
0.85 ±0.1
Seating
plane
A
9.6 CTR
6.4 CTR
0.12 A
78X Ø0.45
11.5 ±0.15
Ball A1 ID
0.8 TYP
8 ±0.15
0.25 MIN
9 8 7 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
Note:
1. All dimensions are in millimeters.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains initial characterization limits that are subject to change upon full characterization of production devices.
Preliminary
4Gb: x4, x8 1.35V TwinDie DDR3L SDRAM
Package Dimensions
PDF: 09005aef8460911b
DDR3L_4Gb_1_35V_TwinDie.pdf - Rev. B 4/11 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
