©2011 Silicon Storage Technology, Inc. DS75030A 10/11
15
2.4 GHz High-Power, High-Gain Power Amplifier
SST12LP15
Not Recommended for New Designs
Microchip Technology Company
Packaging Diagrams
Figure 13: 16-Contact Very-thin Quad Flat No-lead (VQFN)
SST Package Code: QVC
Note: 1. Complies with JEDEC JEP95 MO-220J, variant VEED-4 except external paddle nominal dimensions.
2. From the bottom view, the pin 1 indicator ma y be either a 45-degree chamfer or a half-circle notch.
3. The external paddle is electrically connected to the die back-side and possibly to certain V
SS
leads.
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the V
SS
of the unit.
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
4. Untoleranced dimensions are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
16-vqfn-3x3-QVC-2.0
1.7
0.5 BSC
See notes
2 and 3
Pin 1
0.30
0.18
0.075
1.7
0.2
0.05 Max
0.45
0.35
1.00
0.80
Pin 1
TOP VIEW BOTTOM VIEWSIDE VIEW
1mm
3.00
± 0.075
3.00
± 0.075
