10
Precautionary Notes
1. Handling precautions
The encapsulation material of the LED is made of
silicone for better product reliability. Compared to
epoxyencapsulant that is hard and brittle, silicone is
softerand exible. Special handling precautions must
be observed during assembly of silicone encapsulated
LED products. Failure to comply might lead to damage
and premature failure of the LED. Refer to Application
Note AN5288, Silicone Encapsulation for LED: Advantages
and Handling Precautions for more information.
a. Do not poke sharp objects into the silicone
encapsulant. Sharp objects, such as tweezers or
syringes, might apply excessive force or even pierce
through the silicone and induce failures to the LED
die or wire bond.
b. Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result
in excessive stress on the wire bond. Hold the LED
only by the body.
c. Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
d. The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone,
use a cotton bud with isopropyl alcohol (IPA).
During cleaning, rub the surface gently without
putting much pressure on the silicone. Ultrasonic
cleaning is not recommended.
e. For automated pick and place, Avago has tested
the following nozzle size to work with this LED.
However, due to the possibility of variations in other
parameters, such as pick and place, machine maker/
model, and other settings of the machine, verify that
the selected nozzle will not cause damage to the
LED.
2. Handling of moisture sensitive device
This product has a Moisture Sensitive Level 2 rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
— An unopened moisture barrier bag (MBB) can
be stored at <40°C/90%RH for 12 months. If the
actual shelf life has exceeded 12 months and
the humidity indicator card (HIC) indicates that
baking is not required, then it is safe to re ow the
LEDs per the original MSL rating.
—
Do not open the MBB prior to assembly (e.g., for IQC).
b. Control after opening the MBB
— Read the HIC d immediately upon opening of the
MBB.
— Keep the LEDs at <30°C/60%RH at all times. All
high temperature-related processes, including
soldering, curing, or rework, must be completed
within 1 year.
c. Control for un nished reel
— Store unused LEDs in a sealed MBB with desiccant
or desiccator at <5%RH.
d. Control of assembled boards
— If the PCB soldered with the LEDs will be subjected
to other high-temperature processes, the PCB
must be stored in a sealed MBB with desiccant or
desiccator at <5%RH to ensure that all LEDs have
not exceeded their oor life of 1 year.
e. Baking is required if:
— The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
— The LEDs are exposed to conditions of >30°C/
60% RH at any time.
— The LED oor life exceeded 168 hrs.
The recommended baking condition is: 60°C±5ºC
for 20 hrs.
Baking should only be done once.
f. Storage
— The soldering terminals of these Avago LEDs are
silver plated. If the LEDs are exposed in ambient
environment for too long, the silver plating
might become oxidized, which a ects its solder-
ability performance. As such, keep unused LEDs
in a sealed MBB with desiccant or in desiccator at
<5%RH.
