Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Product data Rev. 05 — 15 December 2004 40 of 55
9397 750 14472
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
the Boot Vector and Boot Status Bit. After programming the Flash, the status byte
should be programmed to zero in order to allow execution of the user’s application
code beginning at address 0000H.
In-System Programming (ISP): In-System Programming is performed without
removing the microcontroller from the system. The In-System Programming facility
consists of a series of internal hardware resources coupled with internal firmware to
facilitate remote programming of the P89LPC930/931 through the serial port. This
firmware is provided by Philips and embedded within each P89LPC930/931 device.
The Philips In-System Programming facility has made in-system programming in an
embedded application possible with a minimum of additional expense in components
and circuit board area. The ISP function uses five pins (V
DD
, V
SS
, TxD, RxD, and
RST). Only a small connector needs to be available to interface your application to an
external circuit in order to use this feature.
In-Application Programming (IAP): Several In-Application Programming (IAP) calls
are available for use by an application program to permit selective erasing, reading,
and programming of Flash sectors, pages, security bits, configuration bytes, and
device id. All calls are made through a common interface, PGM_MTP. The
programming functions are selected by setting up the microcontroller’s registers
before making a call to PGM_MTP at FF00H.
8.25 User configuration bytes
A number of user-configurable features of the P89LPC930/931 must be defined at
power-up and therefore cannot be set by the program after start of execution. These
features are configured through the use of the Flash byte UCFG1. Please see the
P89LPC930/931 User’s Manual
for additional details.
8.26 User sector security bytes
There are eight User Sector Security Bytes, each corresponding to one sector.
Please see the
P89LPC930/931 User’s Manual
for additional details.
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Product data Rev. 05 — 15 December 2004 41 of 55
9397 750 14472
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
9. Limiting values
[1] The following applies to Limiting values:
a) Stresses above those listed under Tabl e 6 may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any conditions other than those described in Table 7 “DC electrical characteristics”, Table 8 “AC
characteristics” and Table 9 “AC characteristics” of this specification are not implied.
b) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
c) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
Table 6: Limiting values
[1]
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
T
amb(bias)
operating bias ambient temperature 55 +125 °C
T
stg
storage temperature range 65 +150 °C
V
xtal
voltage on XTAL1, XTAL2 pin to V
SS
-V
DD
+ 0.5 V
V
n
voltage on any other pin to V
SS
0.5 +5.5 V
I
OH(I/O)
HIGH-level output current per I/O pin - 20 mA
I
OL(I/O)
LOW-level output current per I/O pin - 20 mA
I
I/O(tot)(max)
maximum total I/O current - 100 mA
P
tot(pack)
total power dissipation per package based on package heat
transfer, not device power
consumption
- 1.5 W
Philips Semiconductors
P89LPC930/931
8-bit microcontrollers with two-clock 80C51 core
Product data Rev. 05 — 15 December 2004 42 of 55
9397 750 14472
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
10. Static characteristics
Table 7: DC electrical characteristics
V
DD
= 2.4 V to 3.6 V unless otherwise specified.
T
amb
=
40
°
Cto+85
°
C for industrial, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
I
DD(oper)
power supply current, operating 3.6 V; 12 MHz
[2]
-1118mA
3.6 V; 18 MHz
[2]
-1423mA
I
DD(idle)
power supply current, Idle
mode
3.6 V; 12 MHz
[2]
- 3.25 5 mA
3.6 V; 18 MHz
[2]
-57mA
I
DD(PD)
power supply current,
Power-down mode, voltage
comparators powered-down
3.6 V
[2]
-5580µA
I
DD(TPD)
power supply current, Total
Power-down mode
3.6 V
[2]
-15µA
(dV
DD
/dt)
r
V
DD
rise rate - - 2 mV/µs
(dV
DD
/dt)
f
V
DD
fall rate - - 50 mV/µs
V
POR
Power-on reset detect voltage - - 0.2 V
V
RAM
RAM keep-alive voltage 1.5 - - V
V
th(HL)
negative-going threshold
voltage
except SCL, SDA 0.22V
DD
0.4V
DD
-V
V
IL
LOW-level input voltage SCL, SDA only 0.5 - 0.3V
DD
V
V
th(LH)
positive-going threshold voltage except SCL, SDA - 0.6V
DD
0.7V
DD
V
V
IH
HIGH-level input voltage SCL, SDA only 0.7V
DD
- 5.5 V
V
hys
hysteresis voltage Port 1 - 0.2V
DD
-V
V
OL
LOW-level output voltage; all
ports, all modes except Hi-Z
I
OL
= 20 mA;
V
DD
= 2.4 V to 3.6 V
[3]
- 0.6 1.0 V
I
OL
= 3.2 mA;
V
DD
= 2.4 V to 3.6 V
[3]
- 0.2 0.3 V
V
OH
HIGH-level output voltage, all
ports
I
OH
= 20 µA;
V
DD
= 2.4 V to 3.6 V;
quasi-bidirectional mode
V
DD
0.3 V
DD
0.2 - V
I
OH
= 3.2 mA;
V
DD
= 2.4 V to 3.6 V;
push-pull mode
V
DD
0.7 V
DD
0.4 - V
I
OH
= 20 mA;
V
DD
= 2.4 V to 3.6 V;
push-pull mode
0.8V
DD
--V
C
ig
input/output pin capacitance
[4]
--15pF
I
IL
logic 0 input current, all ports V
IN
= 0.4 V
[5]
--80 µA
I
LI
input leakage current, all ports V
IN
=V
IL
or V
IH
[6]
--±10 µA
I
TL
logic 1-to-0 transition current,
all ports
V
IN
= 2.0 V at
V
DD
= 3.6 V
[7]
30 - 450 µA
R
RST
internal reset pull-up resistor 10 - 30 k

P89LPC931FDH,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Microcontrollers - MCU 8-bit Microcontrollers - MCU 80C51 8K FL 256B RAM
Lifecycle:
New from this manufacturer.
Delivery:
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