Narrow pitch connectors S35 (0.35mm pitch)
–3–
ACCTB66E 201612-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage 60V AC/DC
Dielectric strength 150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for 1 min.
Insulation resistance Min. 1,000MΩ (Initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩ
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force
• h = 0.6 mm 20 or less pins: Max. 26.0N, pin contact
Over 22 pins: Max. 1. 300 N/pin contact × pin
contacts (Initial stage)
• h = 0.8 mm Max. 1. 300 N/pin contact × pin contacts
(Initial stage)
Composite removal force Min. 0.215N/pin contact × pin contacts
Environmental
characteristics
Ambient temperature –55°C to +85°C No icing or condensation.
Soldering heat resistance
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature
–55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure)
No icing or condensation.
Thermal shock resistance
(Header and socket mated)
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
Humidity 90% to 95% R.H.
Salt water spray resistance
(Header and socket mated)
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance: Max. 90mΩ
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
Salt water concentration 5%±1%
H2S resistance
(Header and socket mated)
After 48 hours
Contact resistance: Max. 90mΩ
Conformed to JEIDA-38-1984
Bath temperature 40°C±2°C,
Gas concentration 3 ppm ±1 ppm,
Humidity 75% to 80% R.H.
Lifetime
characteristics
Insertion and removal life 30 times
Repeated insertion and removal cycles of max. 200 times/
hour
Unit weight
34 pin contacts Socket h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g
Header h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g
Part name Material Surface treatment
Molded portion
Heat resistant plastic (LCP resin)
(UL94V-0)
—
Contact and Post Copper alloy
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3
