IRG4PC40FDPBF

IRG4PC40FDPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
E
G
n-channel
C
V
CES
= 600V
V
CE(on) typ.
= 1.50V
@V
GE
= 15V, I
C
= 27A
Parameter Min. Typ. Max. Units
R
θJC
Junction-to-Case - IGBT ------ ------ 0.77
R
θJC
Junction-to-Case - Diode ------ ------ 1.7 °C/W
R
θCS
Case-to-Sink, flat, greased surface ------ 0.24 ------
R
θJA
Junction-to-Ambient, typical socket mount ----- ----- 40
Wt Weight ------ 6 (0.21) ------ g (oz)
Thermal Resistance
Fast CoPack IGBT
06/17/2010
Absolute Maximum Ratings
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 49
I
C
@ T
C
= 100°C Continuous Collector Current 27
I
CM
Pulsed Collector Current 196 A
I
LM
Clamped Inductive Load Current 196
I
F
@ T
C
= 100°C Diode Continuous Forward Current 15
I
FM
Diode Maximum Forward Current 200
V
GE
Gate-to-Emitter Voltage ± 20 V
P
D
@ T
C
= 25°C Maximum Power Dissipation 160
P
D
@ T
C
= 100°C Maximum Power Dissipation 65
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw. 10 lbfin (1.1 Nm)
Fast: Optimized for medium operating
frequencies ( 1-5 kHz in hard switching, >20
kHz in resonant mode).
Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
Generation 3
 IGBT co-packaged with HEXFRED
TM
ultrafast,
ultra-soft-recovery anti-parallel diodes for use
in bridge configurations
Industry standard TO-247AC package
Benefits
 Generation -4 IGBT's offer highest efficiencies
available
IGBT's optimized for specific application conditions
HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
Designed to be a "drop-in" replacement for equivalent
industry-standard Generation 3 IR IGBT's
W
TO-247AC
www.irf.com 1
Lead-Free
PD - 94911A
IRG4PC40FDPbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
Q
g
Total Gate Charge (turn-on) ---- 100 150 I
C
= 27A
Qge Gate - Emitter Charge (turn-on) ---- 15 23 nC V
CC
= 400V See Fig. 8
Q
gc
Gate - Collector Charge (turn-on) ---- 35 53 V
GE
= 15V
t
d(on)
Turn-On Delay Time ---- 63 ---- T
J
= 25°C
t
r
Rise Time ---- 32 ---- ns I
C
= 27A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time ---- 230 350 V
GE
= 15V, R
G
= 10
t
f
Fall Time ---- 170 250 Energy losses include "tail" and
E
on
Turn-On Switching Loss ---- 0.95 ---- diode reverse recovery.
E
off
Turn-Off Switching Loss ---- 2.01 ---- mJ See Fig. 9, 10, 11, 18
E
ts
Total Switching Loss ---- 2.96 4.0
t
d(on)
Turn-On Delay Time ---- 63 ---- T
J
= 150°C, See Fig. 9, 10, 11, 18
t
r
Rise Time ---- 33 ---- ns I
C
= 27A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time ---- 350 ---- V
GE
= 15V, R
G
= 10
t
f
Fall Time ---- 310 ---- Energy losses include "tail" and
E
ts
Total Switching Loss ---- 4.7 ---- mJ diode reverse recovery.
L
E
Internal Emitter Inductance ---- 13 ---- nH Measured 5mm from package
C
ies
Input Capacitance ---- 2200 ---- V
GE
= 0V
C
oes
Output Capacitance ---- 140 ---- pF V
CC
= 30V See Fig. 7
C
res
Reverse Transfer Capacitance ---- 29 ---- = 1.0MHz
t
rr
Diode Reverse Recovery Time ---- 42 60 ns T
J
= 25°C See Fig.
---- 74 120 T
J
= 125°C 14 I
F
= 15A
I
rr
Diode Peak Reverse Recovery Current ---- 4.0 6.0 A T
J
= 25°C See Fig.
---- 6.5 10 T
J
= 125°C 15 V
R
= 200V
Q
rr
Diode Reverse Recovery Charge ---- 80 180 nC T
J
= 25°C See Fig.
---- 220 600 T
J
= 125°C 16 di/dt 200A/µs
di
(rec)M
/dt Diode Peak Rate of Fall of Recovery ---- 188 ---- A/µs T
J
= 25°C See Fig.
During t
b
---- 160 ---- T
J
= 125°C 17
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 600 ---- ---- V V
GE
= 0V, I
C
= 250µA
V
(BR)CES
/T
J
Temperature Coeff. of Breakdown Voltage ---- 0.70 ---- V/°C V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage ---- 1.50 1.7 I
C
= 27A V
GE
= 15V
---- 1.85 ---- V I
C
= 49A See Fig. 2, 5
---- 1.56 ---- I
C
= 27A, T
J
= 150°C
V
GE(th)
Gate Threshold Voltage 3.0 ---- 6.0 V
CE
= V
GE
, I
C
= 250µA
V
GE(th)
/T
J
Temperature Coeff. of Threshold Voltage ---- -12 ---- mV/°C V
CE
= V
GE
, I
C
= 250µA
g
fe
Forward Transconductance 9.2 12 ---- S V
CE
= 100V, I
C
= 27A
I
CES
Zero Gate Voltage Collector Current ---- ---- 250 µA V
GE
= 0V, V
CE
= 600V
---- ---- 3500 V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
V
FM
Diode Forward Voltage Drop ---- 1.3 1.7 V I
C
= 15A See Fig. 13
---- 1.2 1.6 I
C
= 15A, T
J
= 150°C
I
GES
Gate-to-Emitter Leakage Current ---- ---- ±100 nA V
GE
= ±20V
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
IRG4PC40FDPbF
www.irf.com 3
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
RMS
of fundamental)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
0
10
20
30
40
0.1 1 10 100
f, Fre
q
uenc
y
(
kHz
)
Load Current (A)
A
60% of rated
voltage
Duty cycle: 50%
T = 125°C
T = 90°C
Gate drive as specified
Turn-on losses include
effects of reverse recovery
sink
J
Power Dissipation = 35W
1
10
100
1000
5 6 7 8 9 10 11 12
C
I , Collector-to-Emitter Current (A)
GE
T = 25°C
T = 150°C
J
J
V , Gate-to-Emitter Voltage (V)
A
V = 50V
5µs PULSE WIDTH
CC
1
10
100
1000
110
CE
V , Collector-to-Emitter Voltage (V)
T = 15C
T = 25°C
J
J
V = 15V
20µs PULSE WIDTH
GE
A
I
C
, Collector-to-Emitter Current (A)

IRG4PC40FDPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT Transistors 600V Fast 1-8kHz
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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