4
RF Device Data
Freescale Semiconductor, Inc.
MMG3015NT1
50 OHM TYPICAL CHARACTERISTICS
33
38
4.8
V
CC
, COLLECTOR VOLTAGE (V)
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
37
36
35
34
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
4.9 5 5.25.1
f = 900 MHz
1 MHz Tone Spacing
100-- 4 0 -- 2 0 0 2 0 4 0 6 0 8 0
33
38
T, TEMPERATURE (_C)
Figure 9. Third Order Output Intercept Point
versus Case Temperature
36
35
34
OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dBm)
Figure 10. Third Order Intermodulation Distortion
versus Output Power
P
out
, OUTPUT POWER (dBm)
IMD, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
51015
-- 7 0
-- 2 0
-- 5 0
-- 6 0
-- 4 0
150
10
3
10
5
120
Figure 11. MTTF versus Junction Temperature
10
4
125 130 135 140 145
T
J
, JUNCTION TEMPERATURE (C)
NOTE: The MTTF is calculated with V
CC
=5Vdc,I
CC
=95mA
MTTF (YEARS)
4
0
8
0
f, FREQUENCY (GHz)
Figure 12. Noise Figure versus Frequency
6
4
2
123
NF, NOISE FIGURE (dB)
-- 7 0
-- 2 0
4
P
out
, OUTPUT POWER (dBm)
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
-- 3 0
-- 4 0
-- 5 0
-- 6 0
1614128
ACPR, ADJACENT CHANNEL POWER RATIO (dBc)
20
37
10
V
CC
=5Vdc
f = 900 MHz
1 MHz Tone Spacing
20
-- 3 0
6218
V
CC
= 5 Vdc, f = 2140 MHz
Single--Carrier W--CDMA, 3.84 MHz Channel
Bandwidth, Input Signal PAR = 8.5 dB @
0.01% Probability(CCDF)
V
CC
=5Vdc
V
CC
=5Vdc
f = 900 MHz
1 MHz Tone Spacing
MMG3015NT1
5
RF Device Data
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 40--800 MHz
Figure 14. 50 Ohm Test Circuit Schematic
Figure 15. S21, S11 and S22 versus Frequency
-- 4 0
0
f, FREQUENCY (MHz)
S22
200 400 600 800
20
10
0
-- 1 0
-- 2 0
-- 3 0
S21, S11, S22 (dB)
S21
S11
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3 C4
Z1 Z2
C1
Z5
C2
R1
L1
V
CC
Z4Z3
DUT
Figure 16. 50 Ohm Test Circuit Component Layout
C1
L1
C2
R1
C4
C3
MMG30XX
Rev 2
Z1, Z5 0.347 x 0.058 Microstrip
Z2 0.575 x 0.058 Microstrip
Z3 0.172 x 0.058 Microstrip
Z4 0.403 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
V
CC
=5Vdc
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 0.01 F Chip Capacitors C0603C103J5RAC Kemet
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
L1 470 nH Chip Inductor BK2125HM471--T Taiyo Yuden
R1
0 Ω, 1/10 W Chip Resistor
CRCW06030000FKEA Vishay
6
RF Device Data
Freescale Semiconductor, Inc.
MMG3015NT1
50 OHM APPLICATION CIRCUIT: 800--3600 MHz
Figure 17. 50 Ohm Test Circuit Schematic
Figure 18. S21, S11 and S22 versus Frequency
-- 3 0
30
f, FREQUENCY (MHz)
S22
1200
20
10
0
-- 1 0
-- 2 0
S21, S11, S22 (dB)
S21
S11
1600800 2000 2400 2800 3200 3600
RF
OUTPUT
RF
INPUT
V
SUPPLY
C3
C4
Z1 Z2
C1
Z5
C2
R1
L1
V
CC
Z4Z3
DUT
Figure 19. 50 Ohm Test Circuit Component Layout
C1
L1
C2
R1
C4
C3
Z1, Z5 0.347 x 0.058 Microstrip
Z2 0.575 x 0.058 Microstrip
Z3 0.172 x 0.058 Microstrip
Z4 0.403 x 0.058 Microstrip
PCB Getek Grade ML200C, 0.031,
r
=4.1
MMG30XX
Rev 2
V
CC
=5Vdc
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
C1, C2 150 pF Chip Capacitors C0603C151J5RAC Kemet
C3 0.1 F Chip Capacitor C0603C104J5RAC Kemet
C4 1 F Chip Capacitor C0603C105J5RAC Kemet
L1 56 nH Chip Inductor HK160856NJ--T Taiyo Yuden
R1
0 Ω, 1/10 W Chip Resistor
CRCW06030000FKEA Vishay

MMG3015NT1

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF Amplifier 20.5DBM 15DB GPA SOT89
Lifecycle:
New from this manufacturer.
Delivery:
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