Characteristics BAT54
4/13 Doc ID 5505 Rev 10
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration
Figure 7. Thermal resistance junction to
ambient versus copper surface
under each lead (SOD-323)
Figure 8. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-323)
200
300
400
500
600
0 5 10 15 20 25 30 35 40 45 50
R
th(j-a)
(°C/W)
Epoxy FR4
e
CU
=35 µm
S
CU
(mm²)
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD323
Epoxy FR4
S
CU
=2.25 mm²
e
CU
=35 µm
t
P
(s)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOT-23)
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration (SOD-523)
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Alumine substrate
10 x 8 x 0.5 mm
Single pulse
SOT23
t
P
(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD523
Epoxy FR4
e
CU
=35 µm
t
P
(s)
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT666
Epoxy FR4
e
CU
=35 µm
t
P
(s)
