NCV7351, NCV7351F
www.onsemi.com
13
PACKAGE DIMENSIONS
SOIC−8
CASE 751AZ
ISSUE B
7.00
8X
0.76
8X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE PROTRUSION SHALL BE 0.004 mm IN EXCESS OF
MAXIMUM MATERIAL CONDITION.
4. DIMENSION D DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS
SHALL NOT EXCEED 0.006 mm PER SIDE. DIMENSION E1 DOES
NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EXCEED 0.010 mm PER SIDE.
5. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOT
TOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE OUTER
MOST EXTREMES OF THE PLASTIC BODY AT DATUM H.
6. DIMENSIONS A AND B ARE TO BE DETERMINED AT DATUM H.
7. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 TO 0.25 FROM THE LEAD TIP.
8. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING
PLANE TO THE LOWEST POINT ON THE PACKAGE BODY.
14
85
SEATING
PLANE
DETAIL A
0.10 C
A1
DIM MIN MAX
MILLIMETERS
h 0.25 0.41
A --- 1.75
b 0.31 0.51
L 0.40 1.27
e 1.27 BSC
c 0.10 0.25
A1 0.10 0.25
L2
M
0.25 A-B
b8X
C
D
A
B
C
TOP VIEW
SIDE VIEW
0.25 BSC
E1 3.90 BSC
E 6.00 BSC
D
e
D
0.20 C
0.10 C
2X
NOTE 6
NOTES 4&5
NOTES 4&5
SIDE VIEW
END VIEW
E E1
D
0.10 C D
D
NOTES 3&7
NOTE 6
NOTE 8
A
A2
A2 1.25 ---
D 4.90 BSC
H
SEATING
PLANE
DETAIL A
L
C
L2
h
45 CHAMFER5
c
NOTE 7
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