LC75890W
www.onsemi.com
2
Specifications
Absolute Maximum Ratings at Ta = 25C, V
SS
= 0 V
Parameter Symbol Conditions Ratings Unit
Maximum supply voltage V
DD
max V
DD
0.3 to +4.2
V
V
LCD
max V
LCD
0.3 to +6.5
Input voltage V
IN
1 CE, CL, DI,
INH
0.3 to +4.2
V
V
IN
2 OSCI : External clock operating mode 0.3 to V
DD
+0.3
Output voltage V
OUT
S1 to S37, COM1 to COM4, P1 to P12 0.3 to V
LCD
+0.3 V
Output current I
OUT
1 S1 to S36 300 A
I
OUT
2 COM1 to COM4, S37 3
mA
I
OUT
3 P1 to P12 *1 5
Allowable power dissipation Pd max Ta = 85C 100
mW
Operating temperature Topr 40 to +85 C
Storage temperature Tstg 55 to +125 C
Note : *1 The sum of output current through P1 to P12 must be 40 mA or less.
Allowable Operating Ranges
at Ta = 40 to +85C, V
SS
= 0 V
Parameter Symbol Conditions
Ratings
Unit
min typ max
Supply voltage V
DD
V
DD
2.7 3.6
V
V
LCD
V
LCD
: Internal oscillator operating mode 2.7 5.5
V
LCD
: External clock operating mode V
DD
5.5
Input high-level voltage V
IH
1 CE, CL, DI,
INH
0.7V
DD
3.6
V
V
IH
2 OSCI: External clock operating mode 0.7V
DD
V
DD
Input low-level voltage V
IL
1 CE, CL, DI,
INH
0 0.2V
DD
V
V
IL
2
OSCI: External clock operating mode
0 0.2V
DD
External clock operating
frequency
f
CK
OSCI: External clock operating mode
[Figure 3]
10 38 600 kHz
External clock duty cycle D
CK
OSCI: External clock operating mode
[Figure 3]
30 50 70 %
Data setup time tds CL, DI [Figure 1], [Figure 2] 160 ns
Data hold time tdh CL, DI [Figure 1], [Figure 2] 160 ns
CE wait time tcp CE, CL [Figure 1], [Figure 2] 160 ns
CE setup time tcs CE, CL [Figure 1], [Figure 2] 160 ns
CE hold time tch CE, CL [Figure 1], [Figure 2] 160 ns
High-level clock pulse width
tH CL [Figure 1], [Figure 2] 160 ns
Low-level clock pulse width
tL CL [Figure 1], [Figure 2] 160 ns
Rise time tr CE, CL, DI [Figure 1], [Figure 2] 160 ns
Fall time tf CE, CL, DI [Figure 1], [Figure 2] 160 ns
INH
switching time tc
INH
[Figure 4], [Figure 5] 10 s
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.
