© 2007 Microchip Technology Inc. DS21703G-page 17
24AA16/24LC16B
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
N
otes:
. Pin 1 visual index feature may vary, but must be located within the hatched area.
. Package may have one or more exposed tie bars at ends.
. Package is saw singulated.
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e 0.50 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Length D 2.00 BSC
Overall Width E 3.00 BSC
Exposed Pad Length D2 1.30 – 1.75
Exposed Pad Width E2 1.50 – 1.90
Contact Width b 0.18 0.25 0.30
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
D
N
E
NOTE 1
1
2
EXPOSED PAD
NOTE 1
2
1
D2
K
L
E2
N
e
b
A3 A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
Microchip Technology Drawing C04-123
