© 2007 Microchip Technology Inc. DS21703G-page 19
24AA16/24LC16B
5-Lead Plastic Small Outline Transistor (OT or CT) [SOT-23]
N
otes:
1
. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2
. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 5
Lead Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.90 1.45
Molded Package Thickness A2 0.89 1.30
Standoff A1 0.00 0.15
Overall Width E 2.20 3.20
Molded Package Width E1 1.30 1.80
Overall Length D 2.70 3.10
Foot Length L 0.10 0.60
Footprint L1 0.35 0.80
Foot Angle φ 30°
Lead Thickness c 0.08 0.26
Lead Width b 0.20 0.51
φ
N
b
E
E1
D
1
2
3
e
e1
A
A1
A2
c
L
L1
Microchip Technology Drawing C04-091
B
24AA16/24LC16B
DS21703G-page 20 © 2007 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision D
Corrections to Section 1.0, Electrical Characteristics.
Revision E
Added DFN package.
Revision F
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read; Section
8.3 Write-Protect (WP).
Revision G (02/2007)
Changed 1.8V to 1.7V; Revised Features Section;
Replaced Package Drawings; Revised Product ID
Section.
© 2007 Microchip Technology Inc. DS21703G-page 21
24AA16/24LC16B
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602-00001

Mfr. #:
Manufacturer:
Parallax
Description:
EEPROM 2048-Byte EEPROM (BS2 - DIP)
Lifecycle:
New from this manufacturer.
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DHL FedEx Ups TNT EMS
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