LTC3851A-1
22
3851a1fa
applicaTions inForMaTion
If the two MOSFETs have approximately the same
R
DS(ON)
, then the resistance of one MOSFET can simply
be summed with the resistances of L and R
SENSE
to
obtain I
2
R losses. For example, if each R
DS(ON)
= 10mΩ,
DCR = 10mΩ and R
SENSE
= 5mΩ, then the total resis-
tance is 25mΩ. This results in losses ranging from 2%
to 8% as the output current increases from 3A to 15A
for a 5V output, or a 3% to 12% loss for a 3.3V output.
Efficiency varies as the inverse square of V
OUT
for the
same external components and output power level. The
combined effects of increasingly lower output voltages
and higher currents required by high performance digital
systems is not doubling but quadrupling the importance
of loss terms in the switching regulator system!
4. Transition losses apply only to the topside MOSFET(s),
and become significant only when operating at high
input voltages (typically 15V or greater). Transition
losses can be estimated from:
Transition Loss = (1.7)V
IN
2
• I
O(MAX)
• C
RSS
• f
Other hidden losses such as copper trace and the battery
internal resistance can account for an additional 5% to
10% efficiency degradation in portable systems. It is very
important to include these system level losses during the
design phase. The internal battery and fuse resistance
losses can be minimized by making sure that C
IN
has ad-
equate charge storage and very low ESR at the switch ing
frequency. A 25W supply will typically require a minimum of
20μF to 40μF of capacitance having a maximum of 20mΩ
to 50mΩ of ESR. Other losses including Schottky con-
duction losses during dead time and inductor core losses
generally account for less than 2% total additional loss.
Checking Transient Response
The regulator loop response can be checked by looking at
the load current transient response. Switching regulators
take several cycles to respond to a step in DC (resistive)
load current. When a load step occurs, V
OUT
shifts by an
amount equal to I
LOAD
(ESR), where ESR is the effective
series resistance of C
OUT
. I
LOAD
also begins to charge or
discharge C
OUT
generating the feedback error signal that
forces the regulator to adapt to the current change and
return V
OUT
to its steady-state value. During this recovery
time V
OUT
can be monitored for excessive overshoot or
ringing, which would indicate a stability problem. The
availability of the I
TH
pin not only allows optimization of
control loop behavior but also provides a DC-coupled and
AC-filtered closed-loop response test point. The DC step,
rise time and settling at this test point truly reflects the
closed-loop response. Assuming a predominantly second
order system, phase margin and/or damping factor can be
estimated using the percentage of overshoot seen at this
pin. The bandwidth can also be estimated by examining the
rise time at the pin. The I
TH
external components shown
in the Typical Application circuit will provide an adequate
starting point for most applications.
The I
TH
series R
C
-C
C
filter sets the dominant pole-zero
loop compensation. The values can be modified slightly
(from 0.5 to 2 times their suggested values) to optimize
transient response once the final PC layout is done and
the particular output capacitor type and value have been
determined. The output capacitors need to be selected
because the various types and values determine the loop
gain and phase. An output current pulse of 20% to 80%
of full-load current having a rise time of 1μs to 10μs will
produce output voltage and I
TH
pin waveforms that will
give a sense of the overall loop stability without break ing
the feedback loop. Placing a power MOSFET directly
across the output capacitor and driving the gate with an
appropriate signal generator is a practical way to produce
a realistic load step condition. The initial output voltage
step resulting from the step change in output current may
not be within the bandwidth of the feedback loop, so this
signal cannot be used to determine phase margin. This
is why it is better to look at the I
TH
pin signal which is in
the feedback loop and is the filtered and compensated
control loop response. The midband gain of the loop will
be in creased by increasing R
C
and the bandwidth of the
loop will be increased by decreasing C
C
. If R
C
is increased
by the same factor that C
C
is decreased, the zero frequency
will be kept the same, thereby keeping the phase shift the
same in the most critical frequency range of the feedback
loop. The output voltage settling behavior is related to the
stability of the closed-loop system and will demonstrate
the actual overall supply performance.
LTC3851A-1
23
3851a1fa
A second, more severe transient is caused by switching
in loads with large (>1μF) supply bypass capacitors. The
discharged bypass capacitors are effectively put in parallel
with C
OUT
, causing a rapid drop in V
OUT
. No regulator can
alter its delivery of current quickly enough to prevent this
sudden step change in output voltage if the load switch
resistance is low and it is driven quickly. If the ratio of
C
LOAD
to C
OUT
is greater than 1:50, the switch rise time
should be controlled so that the load rise time is limited
to approximately 25 C
LOAD
. Thus a 10μF capacitor would
require a 250μs rise time, limiting the charging current
to about 200mA.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3851A-1. These items are also illustrated graphically
in the layout diagram of Figure 9. Check the following in
your layout:
1. Are the board signal and power grounds segregated?
The LTC3851A-1 GND pin should tie to the ground plane
close to the input capacitor(s). The low current or signal
ground lines should make a single point tie directly to
the GND pin. The synchronous MOSFET source pins
should connect to the input capacitor(s) ground.
applicaTions inForMaTion
Figure 9. LTC3851A-1 Layout Diagram
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
MODE/PLLIN
FREQ/PLLFLTR
RUN
TK/SS
I
TH
V
FB
SENSE
SENSE
+
SW
TG
BOOST
V
IN
INTV
CC
BG
GND
PGOOD
LTC3851A-1
47pF
C
C
C
SS
0.1mF
C
C2
R
FREQ
R
C
R
PGOOD
1000pF
+
C
OUT
R1
R2
C
B
D
B
R
SENSE
D1
M2
+
4.7µF
V
PULL-UP
M1
+
C
IN
+
L1
V
IN
+
V
OUT
3851A1 F09
LTC3851A-1
24
3851a1fa
applicaTions inForMaTion
2. Does the V
FB
pin connect directly to the feedback resis-
tors? The resistive divider R1, R2 must be connected
between the (+) plate of C
OUT
and signal ground. The
47pF to 100pF capacitor should be as close as possible
to the LTC3851A-1. Be careful locating the feedback
resistors too far away from the LTC3851A-1. The V
FB
line should not be routed close to any other nodes with
high slew rates.
3. Are the SENSE
and SENSE
+
leads routed together
with minimum PC trace spacing? The filter capacitor
between SENSE
+
and SENSE
should be as close as
possible to the LTC3851A-1. Ensure accurate current
sensing with Kelvin connections as shown in Figure 10.
Series resistance can be added to the SENSE lines to
increase noise rejection and to compensate for the ESL
of R
SENSE
.
4. Does the (+) terminal of C
IN
connect to the drain of
the topside MOSFET(s) as closely as possible? This
capacitor provides the AC current to the MOSFET(s).
5. Is the INTV
CC
decoupling capacitor connected closely
between INTV
CC
and GND? This capacitor carries the
MOSFET driver peak currents. An addi tional 1μF ceramic
capacitor placed immediately next to the INTV
CC
and
GND pins can help improve noise performance.
6. Keep the switching node (SW), top gate node (TG) and
boost node (BOOST) away from sensitive small-signal
nodes, especially from the voltage and current sensing
feedback pins. All of these nodes have very large and
fast moving signals and therefore should be kept on
the “output side” (Pin 9 to Pin 16) of the LTC3851A-1
and occupy minimum PC trace area.
PC Board Layout Debugging
It is helpful to use a DC-50MHz current probe to monitor
the current in the inductor while testing the circuit. Monitor
the output switching node (SW pin) to synchronize the
oscilloscope to the internal oscillator and probe the actual
output voltage as well. Check for proper performance over
the operating voltage and current range expected in the
application. The frequency of operation should be main-
tained over the input voltage range down to dropout and
until the output load drops below the low current opera-
tion threshold—typically 10% of the maximum designed
cur rent level in Burst Mode operation.
The duty cycle percentage should be maintained from cycle
to cycle in a well designed, low noise PCB imple mentation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pick-up at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regulator
bandwidth optimization is not required.
Reduce V
IN
from its nominal level to verify operation
of the regulator in dropout. Check the operation of the
undervoltage lockout circuit by further lowering V
IN
while
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
for inductive coupling between C
IN
, the Schottky and the
top MOSFET to the sensitive current and voltage sens-
ing traces. In addition, investigate common ground path
voltage pickup between these components and the GND
pin of the IC.
Figure 10. Kelvin Sensing R
SENSE
SENSE
+
SENSE
HIGH CURRENT PATH
3851A1 F10
CURRENT SENSE
RESISTOR
(R
SENSE
)

LTC3851AHMSE-1#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 40Vin Synchronous Step-Down Switching Controller
Lifecycle:
New from this manufacturer.
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