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Package mechanical data M41T256Y
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6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 15. SOH44 – 44-lead plastic small outline, SNAPHAT, package outline
Note: Drawing is not to scale.
Table 11. SOH44 – 44-lead plastic small outline, SNAPHAT, package mech. data
SOH-A
E
N
D
C
LA1 α
1
H
A
CP
Be
A2
eB
Symb
mm inches
Typ Min Max Typ Min Max
A 3.05 0.120
A1 0.05 0.36 0.002 0.014
A2 2.34 2.69 0.092 0.106
B 0.36 0.46 0.014 0.018
C 0.15 0.32 0.006 0.012
D 17.71 18.49 0.697 0.728
E 8.23 8.89 0.324 0.350
e0.81– –0.032– –
eB 3.20 3.61 0.126 0.142
H 11.51 12.70 0.453 0.500
L 0.41 1.27 0.016 0.050
a0°8°0°8°
N44 44
CP 0.10 0.004
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