BUK9213-30A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 18 February 2011 4 of 13
NXP Semiconductors
BUK9213-30A
N-channel TrenchMOS logic level FET
5. Thermal characteristics
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
03nf62
10
1
1
10
10
2
10
3
1 10 10
2
V
DS
(V)
I
D
(A)
DC
100 ms
10 ms
Limit R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10 μs
100 μs
capped at 55 A
due to bondwires
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-mb)
thermal resistance from
junction to mounting base
see Figure 4 -0.561K/W
R
th(j-a)
thermal resistance from
junction to ambient
- 71.4 - K/W
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration
03nf63
single shot
0.2
0.1
0.05
0.02
10
3
10
2
10
1
1
10
6
10
5
10
4
10
3
10
2
10
1
1
t
p
(s)
Z
th(j-mb)
(K/W)
δ = 0.5
t
p
t
p
T
P
t
T
δ =
BUK9213-30A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 18 February 2011 5 of 13
NXP Semiconductors
BUK9213-30A
N-channel TrenchMOS logic level FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
=0.25mA; V
GS
=0V; T
j
=25°C 30--V
I
D
=0.25mA; V
GS
=0V; T
j
= -55 °C 27 - - V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
=V
GS
; T
j
=-5C;
see Figure 10
--2.3V
I
D
=1mA; V
DS
=V
GS
; T
j
= 175 °C;
see Figure 10
0.5--V
I
D
=1mA; V
DS
=V
GS
; T
j
=2C;
see Figure 10
11.52V
I
DSS
drain leakage current V
DS
=30V; V
GS
=0V; T
j
= 175 °C - - 500 µA
V
DS
=30V; V
GS
=0V; T
j
= 25 °C - 0.05 10 µA
I
GSS
gate leakage current V
GS
=10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
V
GS
=-10V; V
DS
=0V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=10V; I
D
=25A; T
j
=2C - 9 11 m
V
GS
=5V; I
D
=25A; T
j
= 175 °C;
see Figure 11; see Figure 12
--24m
V
GS
=4.5V; I
D
=25A; T
j
= 25 °C - - 14.4 m
V
GS
=5V; I
D
=25A; T
j
=2C;
see Figure 11; see Figure 12
-1113m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=24V; V
GS
=5V;
T
j
=2C; see Figure 13
-37-nC
Q
GS
gate-source charge - 7 - nC
Q
GD
gate-drain charge I
D
25 A; V
DS
=24V; V
GS
=5V;
T
j
=2C; see Figure 13
-18-nC
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
=2C; see Figure 14
- 2140 2852 pF
C
oss
output capacitance - 550 660 pF
C
rss
reverse transfer
capacitance
- 334 457 pF
t
d(on)
turn-on delay time V
DS
=20V; R
L
=2.7; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
-26-ns
t
r
rise time - 202 - ns
t
d(off)
turn-off delay time V
DS
=20V; R
L
=2.7; V
GS
=5V;
R
G(ext)
=10; T
j
25 °C
- 134 - ns
t
f
fall time V
DS
=20V; R
L
=2.7; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
- 158 - ns
L
D
internal drain
inductance
measured from drain to centre of die;
T
j
=2C
-2.5-nH
L
S
internal source
inductance
measured from source lead to source
bond pad; T
j
=2C
-7.5-nH
BUK9213-30A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 18 February 2011 6 of 13
NXP Semiconductors
BUK9213-30A
N-channel TrenchMOS logic level FET
Source-drain diode
V
SD
source-drain voltage I
S
=15A; V
GS
=0V; T
j
=2C;
see Figure 15
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs;
V
GS
=-10V; V
DS
=20V; T
j
=2C
-55-ns
Q
r
recovered charge - 24 - nC
Table 6. Characteristics …continued
Symbol Parameter Conditions Min Typ Max Unit
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 7. Sub-threshold drain current as a function of
gate-source voltage
Fig 8. Forward transconductance as a function of
drain current; typical values
03nj73
0
100
200
300
0246810
V
DS
(V)
I
D
(A)
label is V
GS
(V)
7
6
5
4.8
4.6
4.4
4.2
4
3.8
3.6
3.4
3.2
3
2.8
2.6
2.4
10
9
8
03nj72
6
8
10
12
14
16
0 5 10 15
V
GS
(V)
R
DSon
(mΩ)
03aa36
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
0123
V
GS
(V)
I
D
(A)
maxtypmin
03nj70
0
20
40
60
0 204060
I
D
(A)
g
fs
(S)

BUK9213-30A,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 30V 55A DPAK
Lifecycle:
New from this manufacturer.
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