DocID6115 Rev 8 5/12
STPS2H100 Characteristics
12
Figure 13. Forward voltage drop versus forward
current (low level)
Figure 14. Forward voltage drop versus forward
current (high level)
I (A)
FM
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
I (A)
FM
1
10
100
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
T
j
=25°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Maximum values)
T
j
=125°C
(Typical values)
T
j
=125°C
(Typical values)
V (V)
FM
Figure 15. Thermal resistance junction to
ambient versus copper surface under each lead
(SMA)
Figure 16. Thermal resistance junction to
ambient versus copper surface under each lead
(SMAflat)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMA
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
R (°C/W)
th(j-a)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMAflat
S (cm²)
CU
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
Figure 17. Thermal resistance junction to
ambient versus copper surface under each lead
(SMB)
Figure 18. Thermal resistance junction to
ambient versus copper surface under each lead
(SMBflat)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMB
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
CU
SMBflat
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
