© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 1
1 Publication Order Number:
NTLUS4930N/D
NTLUS4930N
Power MOSFET
30 V, 6.1 A, Single N−Channel,
2.0x2.0x0.55 mm mCoolt UDFN6 Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile UDFN 2.0 x 2.0 x 0.55 mm for Board Space Saving
• Low R
DS(on)
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Battery Switch
• Power Load Switch
• DC−DC Converters
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter Symbol Value Unit
Drain-to-Source Voltage V
DSS
30 V
Gate-to-Source Voltage V
GS
±20 V
Continuous Drain
Current (Note 1)
Continuous Drain
Current (Note 1)
Steady
State
T
A
= 25°C
I
D
6.1
A
T
A
= 85°C 4.4
t ≤ 5 s T
A
= 25°C 9.3
Power Dissipa-
tion (Note 1)
Steady
State
T
A
= 25°C
P
D
1.65
W
t ≤ 5 s T
A
= 25°C 3.8
Continuous Drain
Current (Note 2)
Steady
State
T
A
= 25°C
I
D
3.8
A
T
A
= 85°C 2.8
Power Dissipation (Note 2) T
A
= 25°C P
D
0.65 W
Pulsed Drain Current
tp = 10 ms
I
DM
19 A
MOSFET Operating Junction and Storage
Temperature
T
J
,
T
STG
-55 to
150
°C
Source Current (Body Diode) (Note 1) I
S
1.65 A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm
2
, 2 oz. Cu.
http://onsemi.com
N−CHANNEL MOSFET
30 V
28.5 mW @ 10 V
36 mW @ 4.5 V
R
DS(on)
MAX I
D
MAXV
(BR)DSS
MOSFET
UDFN6
(mCOOL])
CASE 517BG
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
AD= Specific Device Code
M = Date Code
G = Pb−Free Package
AD MG
G
1
MARKING DIAGRAM
(Top View)
(*Note: Microdot may be in either location)
6.1 A
D
S
G
PIN CONNECTIONS
5.5 A
Pin 1
D
S
1
2
3
6
5
4
D
D
S
D
D
G
D
S
