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a pc board, all contact pins should be aligned and inserted into the pc board simultaneously to prevent
twisting or bending of the contacts. If using robotic equipment, a total equipment accuracy of +
0.13 mm,
including the gripper and fixture tolerance and equipment repeatability, is required.
B. Seating Connectors
Seating force must be applied evenly on the connectors to prevent deformation or other damage to the
contacts and housings. The standoffs must be within 0.13 mm of the pc board (after insertion or
soldering). Refer to Paragraph 3.8.
When installing vertical pin header connectors with compliant pins, the insertion force must be
simultaneously applied to the shoulder of each contact on the inside floor surface of the connector. When
installing right--angle connectors with compliant contact pins, the insertion force must be evenly applied to
the back/top surface of the connector housing (see Figure 1) with a force of approximately 67 N per pin.
When installing vertical pin header connectors with solder tines, the insertion force must be evenly
distributed to the inside floor surface of the connector. When installing right--angle connectors with solder
tines, the insertion force must be evenly applied to the back/top surface of the connector housing (See
Figure 1) with a force of approximately 40 N per each 12 mm of length of the connector. Connectors will
remain securely on the pc board until passed through soldering providing that they are not jarred in any
manner . Tooling recommendations are covered in Section 5.
3.7. Soldering
Connectors with solder tines must be soldered to the pc board.
A. Flux Selection
The solder tines must be fluxed prior to soldering with a rosin base flux. Selection of the proper flux will
depend on the type of pc board and other components mounted on the pc board. The flux must be
compatible with the wave solder line, and all manufacturing and safety requirements.
To avoid personal injury, strict attention must be given to the recommendations of the solvent manufacturer regarding
toxicity and other safety requirements. Request the Material Safety Data Sheet (MSDS) from the supplier.
B. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. A list of common cleaning solvents that will not affect
the connectors for the time and temperature specified is provided in Figure 8.
CLEANER
TIME
TEMPERATUR ES (Max)
NAME TYPE
(Minutes)
CELSIUS FAHRENHEIT
ALPHA 2110 Aqueous 1 132 270
BIOACT EC--7 Solvent 5 100 212
CARBITOL Solvent 1 Room Ambience
Isopropyl Alcohol Solvent 5 100 212
KESTER 5778 Aqueous 5 100 212
KESTER 5779 Aqueous 5 100 212
LONCOTERGE 520 Aqueous 5 100 212
LONCOTERGE 530 Aqueous 5 100 212
Terpene Solvent Solvent 5 100 212
Figure 8
C. Drying
When drying cleaned assemblies and pc boards, do not exceed the temperature limitations of --55_ to
125_C[--99_ to 225_F]. Excessive temperatures may cause housing degradation.
ALPHA, BIOACT, CARBITOL, KESTER, and LONCOTERGE are trademarks of their respective owners.
DANGER
