114- 1075
Rev E 9 of 15
NUMBER O F SIGNAL POSITIONS
4--ROW 5--ROW
630 125 250
-- -- --
540 107 214
264 330 65 130
240 300 59 118
216 270 53 106
192 240 47 94
168 210 41 82
144 180 35 70
120 150 29 58
96 120 23 46
72 90 17 34
48 60 11 22
24 30 5 10
Figure 6 (end)
C. Contact Hole Configuration
The contact holes in the pc board for all connectors must be prepared to the dimensions specified in
Figure 7.
1.12 Min
Pad Diameter
0.025--0.050
Copper Plating
0.65--0.80 (Ref)
Diameter of Finished
Hole After Plating
FR--4
Material
0.81--0.86
Drilled Hole
Diameter
PC Board Thickness
(See Paragraph 3.5)
Surface Finish (See Table Below)
SURFACE FINISH
THICKNESS PLATING
0.004--0.010 Hot Air Solder Leveling (HASL) Tin--Lead (Sn Pb)
0.0005--0.004 Immersion Tin (Sn)
0.0002--0.0005 Organic Solderability Preservative (OSP)
0.0001--0.0005 Au,
0.00127--0.0076 Ni
Immersion Gold (Au) Over Nickel (Ni) (ENIG)
0.0001--0.0005 Immersion Silver (Ag)
Figure 7
3.6. Special Handling
A. Initial Positioning
Prior to positioning a connector , the pc board should be placed on an appropriate board support fixture.
Connectors should be gripped by the housing only and not by the contacts. When placing a connector into
