2
IRS2153(1)D
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead.
The thermal resistance and power dissipation ratings are measured under board mounted and still air
conditions.
Parameter
Symbol Definition Min. Max. Units
V
B
High side floating supply voltage -0.3 625
V
S
High side floating supply offset voltage
V
B
- 25 V
B
+ 0.3
V
HO
High side floating output voltage
V
S
– 0.3 V
B
+ 0.3
V
LO
Low side output voltage -0.3
V
CC
+ 0.3
V
I
RT
R
T
pin current
-5 5 mA
V
RT
R
T
pin voltage
-0.3
V
CC
+ 0.3
V
CT
C
T
pin voltage
-0.3
V
CC
+ 0.3
V
I
CC
Supply current (Note 1) --- 20
I
OMAX
Maximum allowable current at LO and HO due to external
power transistor Miller effect.
-500 500
mA
dV
S
/dt
Allowable offset voltage slew rate -50 50 V/ns
P
D
Maximum power dissipation @ T
A
≤ +25 ºC, 8-Pin DIP
--- 1.0
P
D
Maximum power dissipation @ T
A
≤ +25 ºC, 8-Pin SOIC
--- 0.625
W
R
thJA
Thermal resistance, junction to ambient, 8-Pin DIP --- 85
R
thJA
Thermal resistance, junction to ambient, 8-Pin SOIC --- 128
ºC/W
T
J
Junction temperature -55 150
T
S
Storage temperature -55 150
T
L
Lead temperature (soldering, 10 seconds) --- 300
ºC
Note 1:
This IC contains a zener clamp structure between the chip V
CC
and COM which has a nominal
breakdown voltage of 15.4 V. Please note that this supply pin should not be driven by a DC, low
impedance power source greater than the V
CLAMP
specified in the Electrical Characteristics section.
