14 GHz to 32 GHz, GaAs, MMIC,
Data Sheet
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Passive: no dc bias required
Conversion loss (downconverter): 9 dB typical at 14 GHz to
30 GHz
Single-sideband noise figure: 11 dB typical at 14 GHz to
30 GHz
Input IP3 (downconverter): 20 dBm typical at 14 GHz to
30 GHz
Input P1dB compression point (downconverter): 12 dBm
typical at 14 GHz to 30 GHz
Input IP2: 53 dBm typical at 14 GHz to 30 GHz
RF to IF isolation: 30 dB typical at 14 GHz to 30 GHz
LO to RF isolation: 46 dB typical at 14 GHz to 30 GHz
LO to IF isolation: 34 dB typical at 14 GHz to 30 GHz
RF return loss: 10 dB typical at 14 GHz to 30 GHz
LO return loss: 9 dB typical at 14 GHz to 30 GHz
Wide IF frequency range: dc to 8 GHz
Small size: 7-pad bare die [CHIP]
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
2
3
4
567
13885-001
LO
HMC292A
RF
IF
F
igure 1.
GENERAL DESCRIPTION
The HMC292A chip is a miniature, passive, gallium arsenide
(GaAs), monolithic microwave integrated circuit (MMIC),
double balanced mixer that can be used as an upconverter or
a downconverter within the 14 GHz to 32 GHz RF frequency
range with a small chip area. Excellent isolations are provided
by an on-chip balun that requires no external components and
no dc bias.
All data is measured with the chip in a 50 Ω test fixture
connected via 0.076 mm (0.003 inches) ribbon bonds of
minimal length <0.31 mm (<0.012 inches).