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HMC292A

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
HMC292A Data Sheet
Rev. 0 | Page 4 of 17
30 GHz TO 32 GHz RF RANGE
Table 2.
Parameter Symbol Min Typ Max Unit
RF RANGE
RF
30
GHz
LOCAL OSCILLATOR LO
Frequency 30 32 GHz
Drive Level
13
dBm
INTERMEDIATE FREQUENCY IF DC 8 GHz
RF PERFORMANCE AS DOWNCONVERTER
Conversion Loss 11 12.5 dB
Single Sideband (SSB) Noise Figure NF 14 dB
Input Third-Order Intercept IP3 17 21 dBm
Input 1 dB Compression Point
P1dB
14
dBm
Input Second-Order Intercept IP2 65 dBm
RF PERFORMANCE AS UPCONVERTER
Conversion Loss 11 dB
Input Third-Order Intercept IP3 17 dBm
Input 1 dB Compression Point P1dB 8.5 dBm
ISOLATION PERFORMANCE
RF to IF 20 39 dBm
LO to RF 51 dBm
LO to IF 31 38 dBm
RETURN LOSS PERFORMANCE
RF 7 dB
LO 13 dB
Data Sheet HMC292A
Rev. 0 | Page 5 of 17
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
RF Input Power 18 dBm
LO Input Power 26 dBm
IF Input Power 18 dBm
Maximum Junction Temperature 175°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 5.12 mW/°C Above 85°C)
460 mW
Operating Temperature Range −55°C to +85°C
Storage Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 500 V
Field Induced Charged Device Model
(FICDM)
500 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JC
is the junction to case thermal resistance.
Table 4. Thermal Resistance
Package Type θ
JC
Unit
CHIP 195 °C/W
ESD CAUTION
HMC292A Data Sheet
Rev. 0 | Page 6 of 17
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
23
4
RF
GND
GND GND
LO
IF
GND
567
13885-002
HMC292A
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1, 4, 5, 7 GND Ground. These pads must be connected to RF/dc ground. See Figure 3 for the interface schematic.
2 LO Local Oscillator Port. This pad is ac-coupled and matched to 50 Ω. See Figure 4 for the interface schematic.
3 RF Radio Frequency Port. This pad is ac-coupled and matched to 50 Ω. See Figure 5 for the interface schematic.
6 IF
Intermediate Frequency Port. This pad is dc-coupled. For applications, not requiring operation to dc, dc block
this port externally using a series capacitor of a value chosen to pass the necessary IF frequency range. See
Figure 6 for the interface schematic.
INTERFACE SCHEMATICS
GND
13885-003
Figure 3. GND Interface Schematic
LO
13885-004
Figure 4. LO Interface Schematic
RF
13885-006
Figure 5. RF Interface Schematic
IF
13885-005
Figure 6. IF Interface Schematic
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

HMC292A

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Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixers
Lifecycle:
New from this manufacturer.
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