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LTC4308CDD#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
LTC4308
4
4308f
ENABLE, CONNECT, READY Timing
Rising and Falling Propagation Delays and Rise and Fall Times for SDAIN, SDAOUT and SCLIN, SCLOUT
Figure 1. Timing Diagrams
t
PLH_EN
ENABLE
CONNECT
READY
t
PLH_READY
t
PHL_READY
t
PHL_EN
4308 TD01
t
PLH
SDAIN/SCLIN
SDAOUT/SCLOUT
t
PHL
t
RISE
t
FALL
t
RISE
t
FALL
4308 TD02
TIMING DIAGRAMS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
Bus Stuck Low Timeout
t
TIMEOUT
Bus Stuck Low Timer SDAOUT = SCLOUT = 0V
l
25 30 35 ms
Timing Characteristics
f
I2C,MAX
I
2
C Maximum Operating Frequency (Note 3) 400 600 kHz
t
BUF
Bus Free Time Between Stop and Start Condition (Note 3) 1.3 μs
t
HD,STA
Hold Time After (Repeated) Start Condition (Note 3) 100 ns
t
SU,STA
Repeated Start Condition Set-Up Time (Note 3) 0 ns
t
SU,STO
Stop Condition Set-Up Time (Note 3) 0 ns
t
HD,DATI
Data Hold Time Input (Note 3) 0 ns
t
SU,DAT
Data Set-Up Time (Note 3) 100 ns
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: See “Propagation Delays” in the Operations section for a
discussion of t
PHL
and t
PLH
as a function of pull-up resistance and bus
capacitance.
Note 3: Determined by design, not tested in production.
Note 4: Measure points are 0.3 • V
CC
and 0.7 • V
CC
.
Note 5: I
PULLUPAC
varies with temperature and V
CC
voltage as shown in the
Typical Performance Characteristics section.
Note 6: I
CC
test performed with connection circuitry active.
Note 7: All currents into pins are positive; all voltages are referenced to
GND unless otherwise specifi ed.
The l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at T
A
= 25°C. V
CC
= 3.3V, unless otherwise noted.
LTC4308
5
4308f
T
A
= 25°C, V
CC
= 3.3V, unless otherwise indicated.
TYPICAL PERFORMANCE CHARACTERISTICS
I
CC
Enabled Current
vs Temperature
I
SD
Disabled Current
vs Temperature
Input-Output High to Low
Propagation Delay
vs Temperature
Boost Pull-Up Current
vs Temperature
Input-Output High to Low
Propagation Delay vs Output
Capacitance
Input-Output Offset Voltage
vs Pull-Up Resistance
Output-Input Offset Voltage
vs Pull-Up Resistance
TEMPERATURE (°C)
–50
I
CC
ENABLED CURRENT (mA)
5.5
6.0
6.5
25
75
4308 G01
5.0
4.5
4.0
–25 0 50
7.0
7.5
8.0
100
V
CC
= 5.5V
V
CC
= 3.3V
V
CC
= 2.3V
TEMPERATURE (°C)
–50
600
I
SD
DISABLE CURRENT (μA)
650
800
750
700
850
–25
0
25 50
4308 G02
75
900
950
1000
100
TEMPERATURE (°C)
–50
40
PROPAGATION DELAY (ns)
60
80
100
–25
0
25 50
4308 G03
75
120
140
100
V
CC
= 5.5V
V
CC
= 3.3V
V
CC
= 2.3V
C
IN
= C
OUT
= 50pF
R
PULLUPIN
= R
PULLUPOUT
= 2.7k
TEMPERATURE (°C)
–50
0
BOOST PULL-UP CURRENT
(mA)
4
8
12
16
20
24
–25
02550
4308 G04
75 100
C
IN
= 50pF, C
OUT
= 1nF
R
PULLUPIN
= R
PULLUPOUT
= 2.7k
V
CC
= 5.5V
V
CC
= 3.3V
V
CC
= 2.3V
OUTPUT CAPACITANCE (pF)
0
50
PROPAGATION DELAY
(ns)
65
80
95
110
125
140
200
400 600
4308 G05
800 1000
C
IN
= 50pF
R
PULLUPIN
= 2.7k
R
PULLUPOUT
= 2.7k
V
CC
= 5.5V
V
CC
= 3.3V
V
CC
= 2.3V
V
PULLUPIN
= 1.8V
V
PULLUPOUT
= V
CC
INPUT BUS PULL-UP RESISTANCE (k)
0
OFFSET VOLTAGE (mV)
–206
–204
–202
–200
–198
4
4308 G06
–196
2
6
8
10
OUTPUT BUS PULL-UP RESISTANCE (k)
0
OFFSET VOLTAGE (mV)
304
302
300
298
296
294
8
4308 G07
246 10
LTC4308
6
4308f
ENABLE (Pin 1): Connection Enable Input. This 0.6V nomi-
nal threshold input pin enables or disables the LTC4308.
For normal operation, pull or connect ENABLE high. Driving
ENABLE below the 0.45V threshold isolates SDAIN from
SDAOUT, SCLIN from SCLOUT, asserts READY low, and
prohibits automatic clock and stop bit generation during a
fault condition. A rising edge on ENABLE after a fault has
occurred forces a connection between SDAIN, SDAOUT
and SCLIN, SCLOUT. Connect to V
CC
if unused.
SCLOUT (Pin 2): Serial Clock Output. Connect this pin to a
SCL bus segment where bus stuck low recovery is desired.
A pull-up resistor should be connected between this pin
and a bus pull-up supply greater than or equal to V
CC
.
SCLIN (Pin 3): Serial Clock Input. Connect this pin to a SCL
bus segment where isolation from bus stuck low issues is
desired. A pull-up resistor should be connected between
this pin and a bus pull-up supply greater than 0.9V.
GND (Pin 4): Device Ground. Connect this pin to a ground
plane for best results.
READY (Pin 5): Connection Ready Status Output. This
open-drain N-channel MOSFET pin pulls low when
ENABLE is low, when the startup and connection sequence
described in the Operation section has not been completed,
or when the LTC4308 disconnects the input and output
pins due to a bus stuck low condition. READY goes high
when ENABLE is high and connection is made between the
input and output pins. Connect a pull-up resistor, typically
10k, from this pin to the bus pull-up supply. This pin can
be left open if unused.
SDAIN (Pin 6): Serial Data Input. Connect this pin to a SDA
bus segment where isolation from bus stuck low issues is
desired. A pull-up resistor should be connected between
this pin and a bus pull-up supply greater than 0.9V.
SDAOUT (Pin 7): Serial Data Output. Connect this pin to a
SDA bus segment where bus stuck low recovery is desired.
A pull-up resistor should be connected between this pin
and a bus pull-up supply greater than or equal to V
CC
.
V
CC
(Pin 8): Supply Voltage Input. Place a bypass capacitor
of at least 0.01μF close to V
CC
for best results.
Exposed Pad (Pin 9, DFN Package Only): Exposed Pad
may be left open or connected to device ground.
PIN FUNCTIONS
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

LTC4308CDD#PBF

Mfr. #:
Buy LTC4308CDD#PBF
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters Low Offset Hot Swappable Bus Buffer
Lifecycle:
New from this manufacturer.
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