SSM3K329R,LF

SSM3K329R
2014-03-01
1
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
SSM3K329R
Power Management Switch Applications
High-Speed Switching Applications
1.8-V drive
Low ON-resistance: R
DS(ON)
= 289 m (max) (@V
GS
= 1.8 V)
: R
DS(ON)
= 170 m (max) (@V
GS
= 2.5 V)
: R
DS(ON)
= 126 m (max) (@V
GS
= 4.0 V)
Absolute Maximum Ratings
(Ta = 25°C)
Characteristic Symbol Rating Unit
Drain-source voltage V
DSS
30 V
Gate-source voltage V
GSS
±12 V
DC I
D
(Note 1) 3.5
Drain current
Pulse I
DP
(Note 1) 7.0
A
P
D
(Note 2)
1
Power dissipation
t = 10s 2
W
Channel temperature T
ch
150 °C
Storage temperature range T
stg
55 to 150 °C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: Mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm
2
)
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance R
th (ch-a)
and Power dissipation P
D
vary depending on board material, board area, board thickness
and pad area. When using this device, please take heat dissipation into consideration
Unit: mm
JEDEC
JEITA
TOSHIBA 2-3Z1A
Weight: 11 mg (typ.)
1: Gate
2: Source
3: Drain
SOT-23F
Start of commercial production
2010-02
SSM3K329R
2014-03-01
2
Electrical Characteristics
(Ta = 25°C)
Characteristic Symbol Test Conditions Min Typ. Max Unit
V
(BR) DSS
I
D
= 1 mA, V
GS
= 0 V 30
Drain-source breakdown voltage
V
(BR) DSX
I
D
= 1 mA, V
GS
= 12 V 18
V
Drain cut-off current I
DSS
V
DS
= 30 V, V
GS
= 0 V 1 μA
Gate leakage current I
GSS
V
GS
= ± 12 V, V
DS
= 0 V ±1 μA
Gate threshold voltage V
th
V
DS
= 3 V, I
D
= 1 mA 0.4 1.0 V
Forward transfer admittance Y
fs
V
DS
= 3 V, I
D
= 1.0 A (Note 3) 2.1 4.2 S
I
D
= 1.0 A, V
GS
= 4.0 V (Note 3) 96 126
I
D
= 0.8 A, V
GS
= 2.5 V (Note 3) 118 170
Drain–source ON-resistance R
DS (ON)
I
D
= 0.5 A, V
GS
= 1.8 V (Note 3) 158 289
mΩ
Input capacitance C
iss
123
Output capacitance C
oss
43
Reverse transfer capacitance C
rss
V
DS
= 15V, V
GS
= 0 V, f = 1 MHz
18
pF
Total gate charge Q
g
1.5
Gate-source charge Q
gs1
0.3
Gate-drain charge Q
gd
V
DS
= 15V, I
D
= 2.0 A
V
GS
= 4 V
0.6
nC
Turn-on time t
on
9.2
Switching time
Turn-off time t
off
V
DD
= 15 V, I
D
= 1.0 A,
V
GS
= 0 to 2.5 V, R
G
= 4.7 Ω
6.4
ns
Drain-source forward voltage V
DSF
I
D
= -3.5 A, V
GS
= 0 V (Note 3)
-0.90
-1.2
V
Note 3: Pulse test
SSM3K329R
2014-03-01
3
Switching Time Test Circuit
Marking Equivalent Circuit
(top view)
Usage Considerations
Let V
th
be the voltage applied between gate and source that causes the drain current (I
D
)
to below (1 mA for the
SSM3K329R). Then, for normal switching operation, V
GS(on)
must be higher than V
th,
and V
GS(off)
must be lower than
V
th.
This relationship can be expressed as: V
GS(off)
< V
th
< V
GS(on).
Take this into consideration when using the device.
2.5 V
t
on
t
off
(b) V
IN
(c) V
OUT
0 V
V
DD
V
DS (ON)
t
r
t
f
10%
90%
90%
10%
(a) Test Circuit
V
DD
= 15 V
R
G
= 4.7 Ω
Duty 1%
V
IN
: t
r
, t
f
< 5 ns
Common Source
Ta = 25°C
0
2.5 V
IN
OUT
V
DD
10 μs
R
G
KKH
1 2
3
1 2
3

SSM3K329R,LF

Mfr. #:
Manufacturer:
Toshiba
Description:
MOSFET SM Sig N-CH MOS 30V 3.5A 12V VGSS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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