7
Figure 5. Exploded view drawing
The components interlock as they are mounted onto
de ned features on the base plate.
The ADNS-5700 sensor is designed for mounting on a
through hole PCB, looking down. The aperture stop and
features on the package align it to the lens (See  gure 3).
The ADNS-5100-001 trim lens provides optics for the
imaging of the surface as well as illumination of the surface
at the optimum angle. Lens features align it to the sensor,
base plate, and clip with the LED.
The ADNS-5200 clip holds the LED in relation to the lens.
The LED must be inserted into the clip and the LED’s leads
formed prior to loading on the PCB. The clip interlocks the
sensor to the lens, and through the lens to the alignment
features on the base plate.
The HLMP-EG3E-xxxxx LED is recommended for
illumination.
Customer Supplied
Base Plate with
recommended
features per IGES
3D Model
Lens
(Full ange shown)
PCB
Sensor
LED
LED CLIP
8
Block Diagram
ZB
ZA
IMAGE
PROCESSOR
Z WHEEL
POWER
ON
RESET
LGND
XY_LED
LED
DRIVE
OSCILLATOR
OSCILLATOR
LED
OSC_IN
OSC_OUT
VOLTAGE
REFERENCE
D
D +
USB
PORT
5 VOLT
POWER
Vdd3
GND
Vdd5
GND
BUTTONS
CONTROL AND
I/O PROCESSOR
GND
TL/B4
B3
B2
B1
TR/B5
ZLED
V
O
L
T
A
G
E
R
E
G
U
L
A
T
O
R
Figure 6. Block Diagram
PCB Assembly Considerations
1. Insert the sensor and all other electrical components
into PCB.
2. Bend the LED leads 90 degrees and then insert the LED
into the assembly clip until the snap feature locks the
LED base.
3. Insert the LED/clip assembly into PCB.
4. This sensor package is only quali ed for wave-solder
process.
5. Wave Solder the entire assembly in a no-wash solder
process utilizing solder  xture. The solder  xture
is needed to protect the sensor during the solder
process. It also sets the correct sensor to PCB distance,
as the lead shoulders do not normally rest on the PCB
surface. The  xture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact. A solder  xture
MUST be used to set the correct sensor to PCB distance.
6. Place the lens onto the base plate.
7. Remove the protective Kapton tape from optical
aperture of the sensor. Care must be taken to
keep contaminants from entering the aperture.
Recommend not placing the PCB facing up during the
entire mouse assembly process. Recommend to hold
the PCB  rst vertically for the Kapton removal process.
8. Insert PCB assembly over the lens onto base plate
aligning post to retain PCB assembly. The sensor
aperture ring should self-align to the lens.
9. The optical position reference for the PCB is set by the
base plate and lens. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
10. Install mouse top case. There MUST be feature in the
top case to press down onto the clip to ensure all
components are interlocked to correct vertical height
9
Design considerations for improving ESD Performance
The table below shows typical values assuming base plate
construction per the Avago Technologies supplied IGES
le and ADNS-5100-001 trim lens. Stand-o of the base
plate shall not be larger than 5mm.
Typical Distance ADNS-5100-001
Creepage 17.9mm
Clearance 9.2mm
Note that the lens material is polycarbonate or polysty-
rene HH30, therefore, cyanoacrylate based adhesives
should not be used as they will cause lens material defor-
mation
Lens/Light Pipe
PCB
Base Plate
Surface
Sensor
Clip
LED
Figure 7. Typical Application

ADNS-5700-H3PB

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
IC USB OPT MOUSE SENSOR 18-DIP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union