Narrow pitch connectors A35US (0.35mm pitch)
–2–
ACCTB65E 201701-T
PRODUCT TYPES
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
For samples, please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Mated height Number of pins
Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.6mm
10 AXG710047 AXG810044
10,000 pieces 20,000 pieces
12 AXG712047 AXG812044
16 AXG716047 AXG816044
20 AXG720047 AXG820044
24 AXG724047 AXG824044
30 AXG730047 AXG830044
34 AXG734047 AXG834044
40 AXG740047 AXG840044
44 AXG744047 AXG844044
50 AXG750047 AXG850044
60 AXG760047 AXG860044
Item Specifications Conditions
Electrical
characteristics
Rated current 0.30A/pin contact (Max. 5 A at total pin contacts)
Rated voltage 60V AC/DC
Dielectric strength 150V AC for 1 min.
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Insulation resistance Min. 1,000MΩ (initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 90mΩ
Based on the contact resistance measurement method
specified by JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 1.300N/pin contact × pin contacts (initial)
Composite removal force Min. 0.215N/pin contact × pin contacts
Contact holding force
(Socket contact)
Min. 0.20N/pin contact
Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No icing or condensation.
Soldering heat resistance
Peak temperature: 260°C or less (on the surface of
the PC board around the connector terminals)
Infrared reflow soldering
300°C within 5 sec. 350°C within 3 sec. Soldering iron
Storage temperature
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
No icing or condensation.
Thermal shock resistance
(header and socket mated)
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-78
Bath temperature 40°C±2°C,
humidity 90% to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to IEC60068-2-11
Bath temperature 35°C±2°C,
saltwater concentration 5%±1%
H2S resistance
(header and socket mated)
48 hours, contact resistance max. 90mΩ
Bath temperature 40°C±2°C,
gas concentration 3 ppm ±1 ppm,
humidity 75% to 80% R.H.
Lifetime
characteristics
Insertion and removal life 30 times
Repeated insertion and removal speed of max. 200 times/
hours
Unit weight 60 pin contacts Socket: 0.02g Header: 0.01g
Part name Material Surface treatment
Molded
portion
LCP resin
(UL94V-0)
—
Contact and
Post
Copper alloy
Contact portion:
Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).
Soldering terminals: Sockets: Base: Ni plating, Surface: Pd+Au flash plating (except the terminal tips)
Headers: Base: Ni plating, Surface: Au plating
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−3
30
Max. 5
30
Max. 5
+3
0
0
−3
