Narrow pitch connectors A35US (0.35mm pitch)
–6–
ACCTB65E 201701-T
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern
design, in order to preserve the
mechanical strength of terminal solder
areas.
2. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
• Socket (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Terminal opening ratio: 70%)
(Metal-part opening ratio: 46%)
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Signal terminal opening ratio: 70%)
(Power terminal opening ratio: 77%)
2.60±0.03
12×C0.15
0.60±0.03
1.325±0.03
1.04±0.03
2.50±0.03
(0.73)
0.20±0.03
1.60±0.03
(0.50)
0.20±0.03
0.35±0.03
: Insulatin
area
(0.35)
8×C0.15
1.325±0.01
0.60±0.01
0.35±0.01
0.18±0.01
2.50±0.01
(0.39)
1.82±0.01
2.60±0.01
1.80±0.01
Please refer to the latest product
specifications when designing your
product.
0.35±0.03
0.20±0.03
0.26±0.03
1.045±0.03
1.48±0.03
(0.50)
0.90±0.03
1.20±0.03
2.20±0.03
(0.39)
0.70±0.03
: Insulation
area
0.20±0.01
0.885±0.01
0.35±0.01
0.18±0.01
1.48±0.01
(0.39)
1.42±0.01
2.20±0.01
0.70±0.01
(0.39)
