TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
10
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
ALS Data Registers (0x04 − 0x05)
The ADC data is expressed as a 16-bit word stored in two 8-bit registers. The read-only ADC data registers
DATALOW and DATAHIGH provide the low and high bytes, respectively, of the 16-bit ADC conversion value.
The conversion value translates directly to units of lux.
Table 5. ALS Data Registers
REGISTER ADDRESS BITS DESCRIPTION
DATALOW 0x04 7:0 ADC conversion low byte
DATAHIGH 0x05 7:0 ADC conversion high byte
ID Register (0x0A)
The ID register is a read-only register that provides the value for the part number. The PARTNO field indicates
the part number of each device given in the Available Options section and will remain constant.
Table 6. ID Register
67542310
CONTROL
Reset
ID
PARTNO Reserved
FIELD BITS DESCRIPTION
FIELD VALUE DEVICE PART NUMBER
1000 TSL45317
PARTNO 7:4
1001 TSL45313
PARTNO
7:4
1010
TSL45315
1011
TSL45311
Reserved 3:0 Reserved
The ID register is useful for validating the device type and for verifying the functionality of the interface. When
used for this purpose, it is recommended that the Reserved field be masked out as follows:
Value = ID AND 0xF0, where AND represents a bit-wise AND function
TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
11
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
HARDWARE APPLICATION INFORMATION
Power Supply Decoupling
The power supply lines must be decoupled with a 0.1-μF capacitor placed as close to the device package as
possible. The bypass capacitor should have low effective series resistance (ESR) and effective series
inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high
frequencies to handle transient currents caused by internal logic switching.
PCB Pad Layout
Suggested PCB pad layout guidelines for the CL package is shown in Figure 8.
0.70
1.35
1.2
0.85
0.95
0.55
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 8. Suggested CL Package PCB Layout
TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
12
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
PACKAGE INFORMATION
PACKAGE CL ChipLED
0.60
0.30
0.15
1.35
0.7
0.1
1.2
Pb
TOP VIEW
END VIEW
BOTTOM VIEW
PIN OUT
TOP VIEW
4 SCL
3 SDA
V
DD
1
GND 2
2.0 0.1
Pin 1
(Note E)
Pin 1
0.3 Min
2.0 0.1
Photodiode Array Area
0.10
0.45
0.277 Nominal
0.277
Nominal
C
L
of Solder Contacts and Photodiode
Array Area (Note B)
C
L
of Solder Contacts and Photodiode
Array Area (Note B)
NOTES: A. All linear dimensions are in millimeters.
B. The die is offset within the package to center the photodiode array to the solder contacts within a tolerance of ± 50 μm.
C. Package top surface is molded with an electrically nonconductive yellow clear plastic compound having an index of refraction
of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. Bottom pin 1 indicator is electrically connected to pin 1.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 9. Package CL — ChipLED Packaging Configuration

TSL45317CL

Mfr. #:
Manufacturer:
ams
Description:
Light to Digital Converters LTD 3V Vdd/1.8V Bus 29h-add 4pin ChipLED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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