TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
13
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
CARRIER TAPE AND REEL INFORMATION
TOP VIEW
DETAIL A
2.18 0.05
A
o
0.254
0.02
5 Max
4.00
8.00
3.50 0.05
1.50
4.00
2.00 0.05
+ 0.30
− 0.10
1.75
B
B
AA
1.00
0.25
DETAIL B
2.18 0.05
B
o
5 Max
0.83 0.05
K
o
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbols on drawing A
o
, B
o
, and K
o
are defined in ANSI EIA Standard 481−B 2001.
D. Each reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 10. Package CL Carrier Tape
TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
14
r
r
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
SOLDERING INFORMATION
The CL package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 7. Solder Reflow Profile
PARAMETER REFERENCE DEVICE
Average temperature gradient in preheating 2.5°C/sec
Soak time t
soak
2 to 3 minutes
Time above 217°C (T1) t
1
Max 60 sec
Time above 230°C (T2) t
2
Max 50 sec
Time above T
peak
−10°C (T3) t
3
Max 10 sec
Peak temperature in reflow T
peak
260° C
Temperature gradient in cooling Max −5°C/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale — for reference only
Time (sec)
Temperature (C)
Figure 11. Solder Reflow Profile Graph
TSL4531
DIGITAL AMBIENT LIGHT SENSOR
TAOS112 − OCTOBER 2011
15
The LUMENOLOGY r Company
r
r
Copyright E 2011, TAOS Inc.
www.taosinc.com
STORAGE INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect
them from ambient moisture during shipping, handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on
the bag when stored under the following conditions:
Shelf Life: 12 months
Ambient Temperature: < 40°C
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator
Card shows that the devices were exposed to conditions beyond the allowable moisture region.
Floor Life
The CL package has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices
removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices
are stored under the following conditions:
Floor Life: 168 hours
Ambient Temperature: < 30°C
Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior
to solder reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.

TSL45317CL

Mfr. #:
Manufacturer:
ams
Description:
Light to Digital Converters LTD 3V Vdd/1.8V Bus 29h-add 4pin ChipLED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet