PBSS303ND_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 14 December 2007 3 of 16
NXP Semiconductors
PBSS303ND
60 V, 3 A NPN low V
CEsat
(BISS) transistor
5. Limiting values
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[5] Pulse test: t
p
10 ms; δ≤10 %.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 60 V
V
CEO
collector-emitter voltage open base - 60 V
V
EBO
emitter-base voltage open collector - 5 V
I
C
collector current
[1]
-1A
[2]
-3A
I
CM
peak collector current single pulse;
t
p
1ms
-6A
I
B
base current - 0.8 A
I
BM
peak base current single pulse;
t
p
1ms
-2A
P
tot
total power dissipation T
amb
25 °C
[1]
- 360 mW
[3]
- 600 mW
[4]
- 750 mW
[2]
- 1.1 W
[1][5]
- 2.5 W
T
j
junction temperature - 150 °C
T
amb
ambient temperature 65 +150 °C
T
stg
storage temperature 65 +150 °C
PBSS303ND_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 14 December 2007 4 of 16
NXP Semiconductors
PBSS303ND
60 V, 3 A NPN low V
CEsat
(BISS) transistor
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm
2
.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm
2
.
[4] Device mounted on a ceramic PCB, Al
2
O
3
, standard footprint.
[5] Pulse test: t
p
10 ms; δ≤10 %.
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 6 cm
2
(3) FR4 PCB, mounting pad for collector 1 cm
2
(4) FR4 PCB, standard footprint
Fig 1. Power derating curves
(1)
T
amb
(°C)
75 17512525 7525
006aaa270
800
400
1200
1600
P
tot
(mW)
0
(2)
(4)
(3)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 350 K/W
[2]
- - 208 K/W
[3]
- - 167 K/W
[4]
- - 113 K/W
[1][5]
--50K/W
R
th(j-sp)
thermal resistance from
junction to solder point
--45K/W
PBSS303ND_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 14 December 2007 5 of 16
NXP Semiconductors
PBSS303ND
60 V, 3 A NPN low V
CEsat
(BISS) transistor
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for collector 1 cm
2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aaa271
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
006aaa272
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
1
10
5
1010
2
10
4
10
2
10
1
t
p
(s)
10
3
10
3
1
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0

PBSS303ND,115

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT TRANS BISS TAPE-7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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