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NFL18SP207X1A3D

P1-P3P4-P6P7-P8
Spec. No. JENF243D-0003J-01 P4/ 8
MURATA MFG.CO., LTD.
Reference
Only
10.2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Top tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Top Tape and Bottom Tape
Top tape
5N min.
Bottom tape
10.4. Peeling off force of top tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
10.5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
10.6. Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□
OOOO 
(1) (2) (3)
(1)
Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y
(△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
10.7. Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
F
165 to 180 degree
Top tape
Bottom tape
Base tape
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
9±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
Spec. No. JENF243D-0003J-01 P5/ 8
MURATA MFG.CO., LTD.
Reference
Only
10.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity in Outer Case
(Reel)
WDH
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
Side on which chips are mounted
(in mm)
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
Resist
Copper foil pattern
No pattern
Small diameter thru hole
0.2
～
0.3
0.4
1.0
2.0
1.2
0.4
0.8
0.8
W
D
Label
H
Spec. No. JENF243D-0003J-01 P6/ 8
MURATA MFG.CO., LTD.
Reference
Only
13.3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
Products shall be located in the sideways
direction (Length:a
b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully so that
products are not subject to the mechanical stress due
to warping the board.
Because they may be subjected the mechanical stress
in order of A C B D.
13.4. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
13.5. Reflow Soldering
1) Soldering paste printing for reflow
· Standard thickness of solder paste: 100µm to 150µm. Standard printing pattern of solder paste.
· Use the solder paste printing pattern of the right pattern.
· For the resist and copper foil pattern, use standard land
dimensions.
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150°C ~ 180°C , 90s ± 30s
Heating above 220°C , 30s ~ 60s above 230°C , 60s max.
Peak temperature 245°C ± 3°C 260°C , 10s
Cycle of reflow 2 times 2 times
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
b
Limit Profile
Standard Profile
90s±30s
230°C
260°C
245°C±3°C
220°C
30s
～
60s
60s max.
180
150
Temp.
Time.(s)
(°C)
2.0
0.4
1.0
1.2
0.4
P1-P3P4-P6P7-P8

NFL18SP207X1A3D

Mfr. #:
Buy NFL18SP207X1A3D
Manufacturer:
Murata Electronics
Description:
EMI Filter Circuits 0603 24pF +/-20% 80nH +/-20% 100mA
Lifecycle:
New from this manufacturer.
Delivery:
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