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M34C02-RDW6TP

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M34C02
Figure 18. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Outline
Note: Drawing is not to scale.
Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Data
Symbol
mm inches
Typ. Min. Max. Typ. Min. Max.
A 1.100 0.0433
A1 0.050 0.150 0.0020 0.0059
A2 0.850 0.750 0.950 0.0335 0.0295 0.0374
b 0.250 0.400 0.0098 0.0157
c 0.130 0.230 0.0051 0.0091
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
E 4.900 4.650 5.150 0.1929 0.1831 0.2028
E1 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 – – 0.0256 – –
CP 0.100 0.0039
L 0.550 0.400 0.700 0.0217 0.0157 0.0276
L1 0.950 0.0374
α 0° 6° 0° 6°
TSSOP8BM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
M34C02
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PART NUMBERING
Table 23. Ordering Information Scheme
Note: 1. Package available only on request.
For a list of available options (speed, package,
etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Of-
fice.
The category of second Level Interconnect is
marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions
are also marked on the inner box label.
Example: M34C02 – W MB 6 T P
Device Type
M34 = ASSP I
2
C serial access EEPROM
Device Function
02 = 2 Kbit (256 x 8)
Operating Voltage
W = V
CC
= 2.5 to 5.5V (400kHz)
L = V
CC
= 2.2 to 5.5V (400kHz)
R = V
CC
= 1.8 to 5.5V (400kHz)
F = V
CC
= 1.7 to 3.6V (100kHz)
Package
BN
1
= PDIP8
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
DS = TSSOP8 (3x3mm² body size, MSOP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
1 = Temperature range 0 to 70 °C.
Device tested with standard test flow
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK® (RoHS compliant)
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M34C02
REVISION HISTORY
Table 24. Revision History
Date Rev. Description of Revision
27-Dec-1999 2.0
Adjustments to the formatting. 0 to 70°C temperature range removed from DC and AC tables.
No change to description of device, or parameters
07-Dec-2000 2.1 New definition of lead soldering temperature absolute rating for certain packages
13-Mar-2001 2.2 -R voltage range added
18-Jul-2002 2.3 TSSOP8 (3x3mm² body size) package (MSOP8) added
22-May-2002 2.4 VFDFPN8 package (MLP8) added
21-Jul-2003 3.0 Document reformatted. -F voltage range added.
17-Mar-2004 4.0
Table of Contents added. MLP package changed. Absolute Maximum Ratings for V
IO
(min)
and V
CC
(min) changed. Soldering temperature information clarified for RoHS compliant
devices. Device grade information clarified
14-Apr-2004 5.0 Typos corrected in Ordering Information example
26-Aug-2004 6.0 Device Grade clarified. Product List summary table added
30-Nov-2004 7.0 SO8 package removed.
14-Oct-2005 8.0
M34C02-R operating frequency upgraded to 400 kHz. Modified Device Internal Reset, page 5,
Figure 5., Maximum RP Value versus Bus Parasitic Capacitance (C) for an I²C Bus, Table
12., Input Parameters, I
CC1
values in Table 13., DC Characteristics (M34C02-W), Table
15., DC Characteristics (M34C02-R), Table 16., DC Characteristics (M34C02-F) and moved
M34C02-R to Table 17., AC Characteristics (M34C02-W, M34C02-L, M34C02-R). Added
Figure 4., Chip Enable input connection. Added EcoPack® and Ambient Operating
Temperature information.
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M34C02-RDW6TP

Mfr. #:
Buy M34C02-RDW6TP
Manufacturer:
STMicroelectronics
Description:
EEPROM 2Kbit Serial EE
Lifecycle:
New from this manufacturer.
Delivery:
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