NCP81074A, NCP81074B
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3
PIN DESCRIPTION
Pin No. Symbol Description
1 IN+ Non−Inverting Input which has logic compatible threshold and hysteresis. If not used, this pin should be
connected to either VDD or GND. It should not be left unconnected.
2 GND Common ground. This ground should be connected very closely to the source of the power MOSFET.
3 GND Common ground. This ground should be connected very closely to the source of the power MOSFET.
4 OUTL Sink pin. Connect to Gate of MOSFET.
5 OUTH Source Pin. Connect to Gate of MOSFET.
6 VDD Power Supply Input Pin.
7 VDD Power supply Input Pin.
8
IN−
Inverting Input which has logic compatible threshold and hysteresis. If not used, this pin should be connect-
ed to either VDD or GND. It should not be left unconnected
Figure 2. TYPICAL APPLICATION CIRCUIT
ABSOLUTE MAXIMUM RATINGS
Parameter
Value
Unit
Min Max
Supply Voltage VDD −0.3 24 V
Output Current (DC) Iout_dc 0.6 A
Reverse Current (Pulse<1 ms)
10 A
Output Current (Pulse<0.5 ms)
Iout_pulse 10 A
Input Voltage IN+, IN− −6 24 V
Output Voltages OUTH, OUTL −0.3 VDD + 0.3 V
Output Voltages (Pulse<0.5 ms)
OUTH, OUTL −3.0 VDD + 3.0 V
Junction Operation Temperature T
J
−40 150 °C
Storage Temperature T
stg
−65 160
Electrostatic Discharge
Human body model, HBM 4000
V
Charge device model, CDM 1000
OUT Latch−up Protection 500 mA
Moisture Sensitivity Level (MSL) MSL1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
